FTG Secures Licensing Agreement With EarthOne Circuit Technologies Corporation
June 28, 2016 | MarketwiredEstimated reading time: 2 minutes
Firan Technology Group Corporation announces a licensing agreement between FTG and EarthOne Circuit Technologies Corporation, whereby FTG will license the eSurface technology owned by EarthOne for use in the manufacture of printed circuit boards. The eSurface technology is proprietary to EarthOne and is used to prepare a wide array of surfaces for metallization. This technology enables printed electronics on a wide range of materials, can work on three dimensional geometries, can yield finer traces with better edge geometries and is a large step towards additive manufacturing. FTG's Chatsworth facility will be the first to implement the eSurface technology.
FTG was introduced to the eSurface technology almost 4 years ago and has been working collaboratively with EarthOne to prove out and advance eSurface technology. The execution of the license agreement is a testament to the value and confidence in the game changing eSurface technology.
"FTG continuously investigates future circuit board manufacturing technologies suitable to the Aerospace and Defense market, such as various additive manufacturing processes and concluded that the eSurface technology is very appropriate for the needs of our customers. This process will help us in producing finer pitch printed circuit boards with improved signal integrity critical to high density and RF applications," stated Brad Bourne, President and CEO of FTG Corporation.
EarthOne's President, Dr. William Wismann, stated, "We are fortunate to have such a capable partner so close to our base operations. We have worked with FTG for several years and look forward to a continued partnership of successes."
Michael Labrador, President of the FTG Chatsworth facility commented, "We are as excited as our customers! FTG has already engaged with a number of globally recognized customers specifically aimed at utilizing eSurface and the advances it provides."
Under the terms of the agreement, FTG is to adopt eSurface for the manufacturing of select high technology electronic parts. FTG plans to undertake an expedited eSurface implementation schedule that includes tooling, engineering, production, quality, sales and service functions. The initiative is expected to result in commercial production within three months, with a goal to scale eSurface production rapidly as the technology becomes a keystone to FTG's future technology roadmap.
About eSurface Technologies
eSurface Technologies is the creator of the eSurface process, a proprietary patent-pending process that can dramatically impacts the manufacturing and design segment of multiple industries. The initial adoption of the eSurface process by the global circuit board manufacturing industry is leading to the innovation of products previously not thought possible. EarthOne Circuit Technologies Corporation (DBA as eSurface Technologies, a privately-held corporation) is based in Newbury Park, California.
About FTG
FTG is an aerospace and defense electronics product and subsystem supplier to customers around the globe. FTG has two operating units:
FTG Circuits is a manufacturer of high technology, high reliability printed circuit boards. Our customers are leaders in the aviation, defense, and high technology industries. FTG Circuits has operations in Toronto, Ontario, Chatsworth, California and a joint venture in Tianjin, China.
FTG Aerospace manufactures illuminated cockpit panels, keyboards and sub-assemblies for original equipment manufacturers of aerospace and defense equipment. FTG Aerospace has operations in Toronto, Ontario, Chatsworth, California, Fort Worth, Texas and Tianjin, China.
Suggested Items
Latest Test and Inspection Solutions from GOEPEL electronic at SMTconnect 2024
04/29/2024 | GOEPEL electronicGOEPEL electronic will be demonstrating automated test and inspection equipment at SMTconnect, taking place in Nuremberg from June 11 to 13, 2024.
SIA Commends CHIPS Act Incentives for Micron’s Manufacturing Projects in New York and Idaho
04/29/2024 | SIAThe Semiconductor Industry Association (SIA) today released the following statement from SIA President and CEO John Neuffer applauding semiconductor manufacturing incentives announced by the U.S. Department of Commerce and Micron.
Real Time with… IPC APEX EXPO 2024: Tools, Training, and Trends in Manufacturing Engineering
04/25/2024 | Real Time with...IPC APEX EXPOGuest Editor Kelly Dack and Product Specialist Erik Bateham of Polar Instruments discuss Polar's latest technology, including their role in aiding manufacturing engineers. They highlight the advanced capabilities of Polar's tools and the critical role of signal integrity analysis, as well as the importance of accurate modeling in board manufacturing. Polar's unique training approach and demonstration contact details are also explored.
TTM Celebrates the Grand Opening of Its First Manufacturing Facility in Penang
04/25/2024 | TTM Technologies, Inc.TTM Technologies, Inc., a leading global manufacturer of technology solutions including mission systems, radio frequency (RF) components and RF microwave/microelectronic assemblies, and quick-turn and technologically advanced printed circuit boards (PCBs), officially opened its first manufacturing plant in Penang, Malaysia with an investment of USD200 million (approximately RM958 million).
Listen Up! The Intricacies of PCB Drilling Detailed in New Podcast Episode
04/25/2024 | I-Connect007In episode 5 of the podcast series, On the Line With: Designing for Reality, Nolan Johnson and Matt Stevenson continue down the manufacturing process, this time focusing on the post-lamination drilling process for PCBs. Matt and Nolan delve into the intricacies of the PCB drilling process, highlighting the importance of hole quality, drill parameters, and design optimization to ensure smooth manufacturing. The conversation covers topics such as drill bit sizes, aspect ratios, vias, challenges in drilling, and ways to enhance efficiency in the drilling department.