Quik-Pak Acquires Wafer-Preparation Firm QBBS
November 25, 2019 | Globe NewswireEstimated reading time: 2 minutes
Quik-Pak, a provider of innovative microelectronic packaging and assembly solutions, today announced it has acquired Santa Clara-based QBBS to broaden its portfolio of wafer-preparation services. The addition of QBBS’s automated back-grinding capability will enable Quik-Pak to process customer wafers in larger volumes. The deal was finalized on November 1, and Quik-Pak will integrate the QBBS technology into its wafer prep line in early January.
The QBBS technology will allow Quik-Pak to perform automated, volume back-grinding of a cassette containing up to 25 whole wafers, from 100mm to 200mm (4 to 8 inches) in diameter, as well as partial wafers and 300mm (12-inch) quartered wafers. Quik-Pak will continue to offer its existing backgrinding services, including thinning wafers as large as 300mm in diameter down to 75 microns, and wafers up to 200mm down to 25 microns (about a third the width of a human hair).
“This acquisition is highly complementary to our existing wafer thinning, dicing and die inspection business,” said Quik-Pak Chief Operating Officer Ken Molitor. “We have had a relationship with QBBS for many years, tapping them to accommodate customers who needed volume back-grinding services. Being able to deliver this capability directly will greatly enhance our customer relationships and allow us to broaden our market reach.”
“Selling the business to Quik-Pak was the right decision at the right time,” noted Carmen Perry, QBBS founder and CEO. “We sought an appropriate exit strategy, and Quik-Pak is on a strong growth path. Our technology and customer base are an excellent fit, and I’m pleased that we were able to strike a mutually beneficial agreement with our longtime partner and proven industry leader.”
According to market research firm Mordor Intelligence, the global market for thin wafer processing and dicing equipment reached US$504.3 million in 2018 and is expected to increase at a CAGR of 6.44 percent between 2019 and 2024. Factors driving the growth in demand for these back-end packaging services include the heightened use of RFID chips in consumer, industrial and other electronics applications and the rapid upsurge in IoT and connected devices.
About Quik-Pak
Quik-Pak, a division of Promex Industries, provides IC packaging, assembly and wafer preparation services in its ISO 9001:2015-certified, ITAR-registered facility in San Diego, Calif. The company’s over-molded QFN/DFN packages and pre-molded air cavity QFN packages provide a fast, convenient solution for prototype to full production needs. Same-day assembly services are provided to reduce time to market. More information is available at www.quik-pak.com.
Suggested Items
Absolute EMS Champions Collaboration Between Humans and Robots in Modern Manufacturing
04/19/2024 | Absolute EMS, Inc.Absolute EMS, Inc., an award-winning EMS provider of turnkey contract manufacturing services, offers a perfect factory environment that seamlessly blends robotic automation with human expertise.
Microsoft, Google Join as Sponsors for First-Ever AI Expo for National Competitiveness
04/19/2024 | SCSPThe Special Competitive Studies Project (SCSP), a non-partisan, non-profit project dedicated to strengthening America’s long-term competitiveness in artificial intelligence (AI), announced today two additional sponsors of the AI Expo for National Competitiveness.
IDTechEx Explores the Role of 3D Cu-Cu Hybrid Bonding in Powering Future HPC and AI Products
04/18/2024 | PRNewswireSemiconductor packaging has evolved from traditional 1D PCB levels to cutting-edge 3D hybrid bonding at the wafer level, achieving interconnecting pitches as small as single micrometers and over 1000 GB/s bandwidth. Key parameters, including Power, Performance, Area, and Cost, are crucial considerations
Intel Brings AI-Platform Innovation to Life at the Olympic Games
04/18/2024 | BUSINESS WIREIntel announced its plans for the Olympic and Paralympic Games Paris 2024. Bringing AI Everywhere, Intel will implement artificial intelligence technology powered by Intel processors on the world’s biggest stage.
Adura Solutions Exhibits at Del Mar 2024
04/18/2024 | Adura SolutionsSumit Tomar, CEO of Adura Solutions, has announced that his company will be exhibiting at this year's Del Mar Electronics and Manufacturing Show to be held at the Del Mar Fairgrounds, San Diego, California, April 24-25.