SMT Perspectives and Prospects: Warren Buffett’s Perpetual Wisdom, Part 1
Smart Automation: What Industry 4.0 Means for Mid-sized Electronics Manufacturing
Global Sourcing Spotlight: Risk Management Strategies in Global Sourcing
New Book Highlights Approaches to Ensure Reliability in Your Assembly Process
December 18, 2019 | I-Connect007Estimated reading time: 1 minute
Learn how to ensure electrochemical reliability with The Printed Circuit Assembler’s Guide to… Process Validation—the latest title in our educational library. The Printed Circuit Assembler’s Guide to… is an ongoing series dedicated to educating those in the circuit board assembly sector, and serves as a valuable resource for electronics industry professionals seeking the most relevant information available.
Given the current trends toward smart infrastructures, industrial internet of things (IIoT), and connected and electric vehicles, electronic circuit boards are deployed into humid and potentially corrosive environments arguably to a greater extent than ever before; hence, they are at greater risk of failures due to electrochemical migration (ECM). Graham Naisbitt of Gen3 explores how establishing acceptable electrochemical reliability of the bare board can be achieved by using both CAF testing and SIR testing.
Dr. Lothar Henneken, senior expert and Six Sigma Blackbelt, automotive electronics at Robert Bosch GmbH, says, “The development of humidity-robust electronic components represents a central task of reliability engineering in view of increasing miniaturization, extended operating times (e.g., autonomous driving), and increasing loads (e.g., e-mobility). Suitable material selection, characterization, and qualification—with the help of CAF and SIR tests—are an important part of this, as is ensuring constant manufacturing processes; the control of which can be carried out by means of regular ionic contamination measurements, in addition to a quality management system.
Dr. Henneken continues, “This book is an excellent reflection of the current state of experts' views on the subject. Recent changes in IPC and IEC documents are explained in an understandable way. Many misinterpretations and emotional views, especially on ionic contamination measurement, are cleared up in a simple manner. The frequently recurring questions about influencing variables on SIR and CAF tests and their significance for material qualification are also summarized and well-founded.”
This is a must-read for those in the industry who are concerned about ECM—especially in automotive—as well as those who want to adopt a better and more rigorous approach to ensuring electrochemical reliability and deal responsibly with the subject of humidity robustness through new, valid, state-of-the-art material and process qualification.
Download your free copy today! You can also view other titles in our full library.
We hope you enjoy The Printed Circuit Assembler’s Guide to… Process Validation.
For more information, contact:
Barb Hockaday
I-Connect007 eBooks
barb@iconnect007.com
+1-916-365-1727 (GMT-7)
Share on:
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
Powering Progress: Summer 2025 Community Magazine Now Available
07/22/2025 | Community MagazineIn the new Summer 2025 edition of Community Magazine, members of the Global Electronics Association demonstrate what progress really looks like—through innovation on the factory floor, influence on public policy, and investment in the next generation of engineers.
TRI to Exhibit at SMTA Queretaro Expo 2025
07/16/2025 | TRITest Research, Inc. (TRI), the leading provider of test and inspection systems for the electronics manufacturing industry, is pleased to announce plans to exhibit at the SMTA Querétaro Expo 2025, scheduled to take place on July 24, 2025, at the Querétaro Centro de Congresos y Teatro Metropolitano.
Global PCB Connections: Let the Spec Fit the Board, Not Just the Brand
07/17/2025 | Jerome Larez -- Column: Global PCB ConnectionsIf you’ve ever seen an excellent PCB quote delayed, or worse, go cold because of a single line on the fab print, you’re not alone. Often, that line reads something like, “Use 370HR only,” or “IT-180A required.” These and other brand-name materials are proven performers, but unless your design needs that specific resin system (say, for RF performance, thermal reliability, or stringent CAF resistance), you may inadvertently be holding your job hostage.
IPC Hall of Fame Spotlight Series: Highlighting Lionel Fullwood
07/15/2025 | Dan Feinberg, I-Connect007Many IPC members who have contributed significantly to IPC and our industry have been awarded the IPC Raymond E. Pritchard Hall of Fame (HOF) Award. Though many early HOF members have passed away and are unknown to today’s IPC membership, their contributions still resonate. This special series on IPC Hall of Fame members provides a reminder of who was honored and why. As a bonus, for those who are still around, we get to find out what these talented individuals are up to today.
TRI Unveils New Platform for Diverse Board Sizes
07/14/2025 | TRITest Research, Inc. (TRI), the leading test and inspection systems provider for the electronics manufacturing industry, proudly introduces a new size configuration for SPI and AOI Models.