New Book Highlights Approaches to Ensure Reliability in Your Assembly Process

Reading time ( words)

Learn how to ensure electrochemical reliability with The Printed Circuit Assembler’s Guide to… Process Validation—the latest title in our educational library. The Printed Circuit Assembler’s Guide to… is an ongoing series dedicated to educating those in the circuit board assembly sector, and serves as a valuable resource for electronics industry professionals seeking the most relevant information available.

Given the current trends toward smart infrastructures, industrial internet of things (IIoT), and connected and electric vehicles, electronic circuit boards are deployed into humid and potentially corrosive environments arguably to a greater extent than ever before; hence, they are at greater risk of failures due to electrochemical migration (ECM). Graham Naisbitt of Gen3 explores how establishing acceptable electrochemical reliability of the bare board can be achieved by using both CAF testing and SIR testing.

Dr. Lothar Henneken, senior expert and Six Sigma Blackbelt, automotive electronics at Robert Bosch GmbH, says, “The development of humidity-robust electronic components represents a central task of reliability engineering in view of increasing miniaturization, extended operating times (e.g., autonomous driving), and increasing loads (e.g., e-mobility). Suitable material selection, characterization, and qualification—with the help of CAF and SIR tests—are an important part of this, as is ensuring constant manufacturing processes; the control of which can be carried out by means of regular ionic contamination measurements, in addition to a quality management system. 

Dr. Henneken continues, “This book is an excellent reflection of the current state of experts' views on the subject. Recent changes in IPC and IEC documents are explained in an understandable way. Many misinterpretations and emotional views, especially on ionic contamination measurement, are cleared up in a simple manner. The frequently recurring questions about influencing variables on SIR and CAF tests and their significance for material qualification are also summarized and well-founded.” 

This is a must-read for those in the industry who are concerned about ECM—especially in automotive—as well as those who want to adopt a better and more rigorous approach to ensuring electrochemical reliability and deal responsibly with the subject of humidity robustness through new, valid, state-of-the-art material and process qualification.

Download your free copy today! You can also view other titles in our full library.

We hope you enjoy The Printed Circuit Assembler’s Guide to… Process Validation.

For more information, contact:

Barb Hockaday
I-Connect007 eBooks
barb@iconnect007.com

+1-916-365-1727 (GMT-7)

04/27/2021 | Dan Beaulieu, D.B. Management Group

When searching for companies to interview, I always look for something unique and that makes the company special. Truth be told, I am a collector of stories about good, well-run, unique companies that we can learn something from. Nova Engineering is one of those companies.

04/22/2021 | Patty Goldman, I-Connect007

In this wide-ranging interview, Patty Goldman speaks with Continental Automotive’s Peter Tranitz about his IPC involvement with press-fit and other automotive standards which have earned him the coveted Dieter Bergman IPC Fellowship Award.

04/22/2021 | Brent Fischthal, Koh Young America

Initiatives like the IPC Connected Factory Exchange (CFX) and IPC-Hermes-9852 underpin efforts within the industry to develop standards and help create a smart factory. These M2M communication standards, guided in part by Industry 4.0, are altering the manufacturing process by improving metrics such as first pass yield and throughput by applying autonomous process adjustments.