Samsung VP to Keynote IWLPC
September 1, 2020 | SMTAEstimated reading time: 1 minute
The International Wafer-Level Packaging Conference and Expo announces Dan Oh, Ph.D., Engineering VP of the Test & System Package (TSP) unit at Samsung Electronics will deliver the opening keynote presentation of the virtual event. The presentation, “Trends, Challenges, Opportunities in Advanced Packaging for Smart Computing Era” will be released on Tuesday, October 13, 2020 at 9:00am US Pacific Time.
Dr. Oh is responsible for developing signal and power integrity and thermal solutions for memory, S. LSI and foundry devices. From 2016 to the end of 2019, Dr. Oh led the Package Development department responsible for both research and development of the entire Samsung product line. During this time, he helped establish an advanced wafer-level packaging laboratory for developing high-end server products such as 2.5D Silicon/RDL interposers, FO-WLP and 3D TSV devices. He also helped research and grow FO-PLP technology for consumer and mobile products commercializing the world’s first FO-PLP product for the Galaxy watch. Dr. Oh received his Ph.D. in electrical engineering from the University of Illinois, Urbana-Champaign in 1995. He has over 30 years of experience in the packaging and signal and power integrity fields with multiple high-tech companies, including Intel, Rambus, and Synopsis. His dedication to his work has led to over 90 patents, patent applications, and over 160 published papers in IEEE journals and conferences. He is also the lead author of the book “High-speed Signaling: Jitter Modeling Analysis and Budgeting.”
The keynote presentation is open to all registered attendees. The technical conference and expo are available on-demand from October 13-30 with a live, online exposition enabled October 13 and 14.
Suggested Items
TRI to Unveil New High-Throughput AOI and AXI at productronica 2023
09/15/2023 | TRITest Research, Inc. (TRI), the leading test and inspection systems provider for the electronics manufacturing industry, will join productronica 2023, which will be held at Messe München Center from November 14 – 17, 2023.
UK Space Agency Launches Consultation on Variable Liability Limits for Orbital Operations
09/15/2023 | UK Space AgencyThe proposals from the UK Space Agency follow a review into the UK’s approach to setting the amount of an operator’s liability in licences for orbital operations, a key commitment of the government’s National Space Strategy.
MediaTek Successfully Develops First Chip Using TSMC's 3nm Process, Set for Volume Production in 2024
09/14/2023 | MediaTekMediaTek and TSMC announced that MediaTek has successfully developed its first chip using TSMC's leading-edge 3nm technology, taping out MediaTek’s flagship Dimensity system-on-chip (SoC) with volume production expected next year.
MKS’ Atotech to Participate in IPCA Expo 2023
09/14/2023 | MKS’ AtotechMKS’ Atotech, a leading surface finishing brand of MKS Instruments, will participate in the upcoming IPCA Expo at Bangalore International Exhibition Centre (BIEC) and showcase its latest PCB manufacturing solutions from September 13 – 15.
Comtech Unveils New BRIDGE Solutions to Increase Access to Global Hybrid Connectivity
09/12/2023 | Business WireComtech launched its new blended, resilient, integrated, digital, global, end-to-end (BRIDGE) connectivity solutions. Comtech’s BRIDGE solutions provide portable, adaptable, full-service communications networks that can be established in a matter of hours and help “bridge the gap” for traditional satellite and terrestrial infrastructures.