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CEVA, Inc., the leading licensor of wireless connectivity and smart sensing technologies, announced that Renesas has licensed a new, high-performance CEVA DSP to power its next-generation automotive System-on-Chip (SoC).
"We are honored that Renesas, a world leading automotive semiconductor supplier, has selected our leading-edge DSP solution for its next-generation automotive SoC," said Gideon Wertheizer, CEO of CEVA. "Automotive manufacturers are continually adopting more cameras, radars and other sensors throughout the car to ensure a safer and more automated driving experience. Our leading-edge DSPs along with our software framework and stringent safety support are set to play a pivotal role in deploying these complex systems."
"In active safety and self-driving applications, DSP processing is a key IP for processing and segmenting sensor data generated by sensors on vehicles," said Naoki Yoshida, Vice President of the Automotive Digital Products Marketing Division at Renesas. "CEVA's automotive DSP solution helps us achieve the underlying processing capabilities required for the technological advances of our next-generation automotive SoC customers."
CEVA's DSP-based solutions for the automotive market target the most demanding sensor processing and AI workloads associated with automated driving and electrification. The NeuPro-S and SensPro products have been licensed by multiple automotive semiconductors and OEMs to power a variety of intelligent processors ranging from ADAS systems (Imaging, Driver Monitoring Systems, Intelligent Cameras, Radar, V2X Communications) battery management, and powertrain platforms.