DENSO, Aeva Collaborate to Bring FMCW 4D LiDAR to Mass Vehicle Market
January 19, 2021 | Business WireEstimated reading time: 1 minute
Aeva Inc., a leader in next generation sensing and perception systems, has announced a collaboration with DENSO, a leading global mobility supplier of advanced automotive technology for major automakers, to bring Aeva’s 4D LiDAR technology to the mass vehicle market.
Aeva’s 4D LiDAR technology is the only viable Frequency Modulated Continuous Wave (FMCW) technology to enable automated driving for series production. Built from the ground up on proprietary silicon photonics technology, Aeva’s 4D LiDAR combines instant velocity measurement for each pixel, long range at high resolution, immunity to other LiDAR or sunlight interference, and scalability at industry leading costs on proven semiconductor processes.
“DENSO is a leader in commercializing advanced technologies at affordable costs and our collaboration is further evidence that Aeva’s 4D LiDAR provides what we believe will be an unparalleled combination of superior performance and scalability,” said Soroush Salehian, Co-Founder and CEO at Aeva. “We’re excited to work alongside DENSO to bring Aeva’s 4D LiDAR to global OEMs looking to implement automated driving across their vehicle programs at scale.”
“Aeva’s FMCW 4D LiDAR solution addresses the missing link for perception in automated driving and advanced driver-assistance systems, with its unique ability to meet the stringent automotive performance and safety requirements,” said Kazuma Natsume, Director of AD & ADAS Engineering Div. 2 at DENSO. “We look forward to collaborating with Aeva to further develop FMCW LiDAR, bring it to the mass market and create a society free from traffic accidents.”
Aeva is engaged with 30 of the top OEM and automotive industry players in the advanced driver assistance and autonomous driving industries, has received strategic investments from Porsche SE, the majority shareholder of VW Group, and has relationships with some of the largest Tier 1 automotive suppliers.
Aeva remains on track to complete its previously announced business combination agreement with InterPrivate Acquisition Corp, a publicly traded special purpose acquisition company, in the first quarter of 2021. The business combination is expected to provide up to $563M in gross proceeds. The combined company is expected to be listed on the New York Stock Exchange under the ticker symbol, “AEVA”.
Suggested Items
Keynote Preview: Reshaping our Engagement With the World
03/28/2024 | Shawn DuBravac, IPCThe widespread integration of AI across various sectors is broadening its impact, from revolutionizing healthcare with Smart solutions to transforming homes into intuitive spaces, highlighting its crucial role in boosting efficiency and addressing complex challenges. In healthcare, we're witnessing a trend toward personalized care with AI-driven devices like intelligent pillows to mitigate snoring, sophisticated sleep monitors, and innovative patient monitoring systems.
Indium Corporation to Present, Exhibit at EPP InnovationsFORUM
03/28/2024 | Indium CorporationIndium Corporation is set to present and exhibit at EPP InnovationsFORUM, one of Europe’s premier single-day electronics manufacturing forums, on April 17 in Leinfelden-Echterdingen, Germany. Topic areas for 2024 will include AI, automation, sustainability, and quality.
Accenture Invests in Sanctuary AI to Bring AI-Powered, Humanoid Robotics to Work Alongside Humans
03/27/2024 | BUSINESS WIREAccenture has made a strategic investment, through Accenture Ventures, in Sanctuary AI, a developer of humanoid general-purpose robots that are powered by AI and can perform a wide variety of work tasks quickly, safely and effectively.
AT&S Well Prepared to Benefit from AI Boom
03/26/2024 | AT&SThe rapid progress in the development of artificial intelligence promises to revolutionize all areas of daily life in the coming years. In order to operate such AI systems, an enormous amount of computing power is required, which is provided by a vast network of data centres.
The IMAPS Show: A Conversation with John Andresakis
03/26/2024 | Marcy LaRont, PCB007 MagazineOn the last day of the IMAPS Device Packaging Conference, Marcy LaRont sat down with industry veteran John Andresakis of Quantic Ohmega, who attended the conference this week. Not his first time at this event, he talked about the conference, advanced technology, and trying to get the word out about the advanced packaging substrates solution Quantic is offering.