University Research Program Accepting Research Proposals to Advance Next-Gen Industry Technology
March 18, 2021 | PRNewswireEstimated reading time: 1 minute
The University Research Program will be accepting proposals beginning April 12, 2021 through November 5, 2021. The Raymond Corporation, a Toyota Industries Company, is sponsoring the University Research Program which was created to encourage and support professors and student researchers to apply their engineering and technical research to discover innovative solutions for the material handling industry.
The sponsored research program is in its fifth cycle of accepting applications for grant funding that can reach up to $500,000. Applicants from North American universities will be evaluated on several criteria, including their possible impact on the future of the material handling industry, timeline and feasibility of budget. Applicants with selected proposals will be announced at MODEX 2022, March 28-31, 2022, in Atlanta.
"We believe new technology and innovative approaches from academia's brightest and most innovative minds can inspire the supply chain of the future," said Michael Field, president and CEO, The Raymond Corporation. "Raymond's investment in the University Research Program is just one way we're showing our commitment to the next generation of material handling leaders."
Winning proposals from previous years included projects surrounding automation, virtual reality (VR) and augmented reality (AR), energy infrastructure, internet of things (IoT) and Industry 4.0. Proposal themes for the 2021-2022 research submissions in the following areas are encouraged, however, given the broad nature of material handling, alternative themes are welcome.
The Future of Logistics
- Material Handling in an Uncertain Future
- Material Handling in a "Smart City"
- Warehouse Design
- Urban and Suburban Package Delivery
Improving Material Handling
- Automation and Material Handling
- Advanced Sensors for Material Handling
- Advanced Vision Systems and Material Handling
Truck and Operation Evolution
- Industrial Design of Vehicles
- Operator Ergonomics
- Neurotechnology Applications in Material Handling
This year, the University Research Program has added a new optional concept paper step in the process. This step is a way that professors and student researchers can connect with the University Research Program reviewers for initial input of their submission. Professors and researchers are encouraged (but not required) to submit a one page concept paper explaining their proposal. Concept papers must be submitted between April 12, 2021 through August 27, 2021 in order to be reviewed.
Suggested Items
Boeing Opens Research & Technology Center in Japan
04/23/2024 | BoeingBoeing today opened a Boeing Research & Technology (BR&T) Center in Japan that will focus on innovation to enable the commercial aviation industry meet its goal of net zero carbon emissions by 2050.
Gartner Forecasts Worldwide IT Spending to Grow 8% in 2024
04/17/2024 | Gartner, Inc.Worldwide IT spending is expected to total $5.06 trillion in 2024, an increase of 8% from 2023, according to the latest forecast by Gartner, Inc. This is an increase from the previous quarter’s forecast of 6.8% growth and puts worldwide IT spending on track to surpass $8 trillion well before the end of the decade.
Argonne, RIKEN Sign a Memorandum of Understanding in Support of AI for Science
04/16/2024 | BUSINESS WIRELeaders in high performance computing in the U.S. and Japan have signed a memorandum of understanding (MOU) establishing a cooperative relationship in support of artificial intelligence (AI) computing projects.
RAICo Fellowship to Widen Participation Within the Field of Robotics and Artificial Intelligence
04/12/2024 | RAICoWOMEN and those early in their academia career who are passionate about robotics and artificial intelligence are encouraged to apply for a RAICo Fellowship.
Indium to Host Free Webinar on Lead-Free Solder Paste for Automotive Applications
04/09/2024 | Indium CorporationIndium Corporation’s Senior Research Metallurgist, Jie Geng, Ph.D., will conduct a webinar on low-voiding, high-reliability, lead-free solder paste for automotive applications.