Hans-Peter Tranitz: Dieter Bergman IPC Fellowship Award Recipient


Reading time ( words)

From the IPC website: The Dieter Bergman IPC Fellowship Award is given to individuals who have fostered a collaborative spirit, made significant contributions to standards development, and have consistently demonstrated a commitment to global standardization efforts and the electronics industry. Each recipient will be eligible to bestow the Dieter Bergman Memorial Scholarship upon the university or college of his/her choice.

Patty Goldman speaks with Continental Automotive’s Peter Tranitz about his IPC involvement with press-fit and other automotive standards which have earned him the coveted Dieter Bergman IPC Fellowship Award. 

Patty Goldman: Peter, congratulations on this award. It’s quite an honor as you’re aware, and it means you have done a lot of work with IPC and standards development. Perhaps you can tell us a little bit about yourself and your involvement with IPC and the different committees.

Hans-Peter Tranitz: Hello, Patty. I’m working for Continental Automotive GmbH. My home location is Regensburg, and my profession is being an expert for mechanical joining technologies for metals and plastics in automotive final assembly, such as press fit and all kinds of technologies dealing with laser and material interaction. Welding, riveting and screwdriving are also within my and my team’s responsibility.

My first contact with IPC was in 2010 when I joined for the first time a tin whisker conference in Schaumburg, Illinois, near Chicago, and there I made a presentation about my current risk issues and how I deal with that. At that time, I felt that the people who joined the meeting were all “dinosaurs” that knew everything about whiskers and then here comes a freshman—even if I was already quite long in the industry at that time.

But, for them, I was a freshman, and I saw this very little smile in their faces when I was presenting. And I felt like, “Oh, they all know what I’m talking about. I don’t tell them anything new.” But when I arrived at the APEX EXPO one year later all of them recognized me and all of them talked to me. And there was a very, very open-minded communication and I felt really accepted right away. That is something which is quite unique and that is what I would consider the special environment that IPC has. I was impressed by its open-minded and warm welcome of new members and new arrivals.

Goldman: Yes, IPC and volunteers love new volunteers. Worker bees, as we call them.

Tranitz: Agreed. After that time, a few years later, I proposed to IPC to start a press-fit standard for the automotive industry and high reliability applications because the current standards that existed were basically coming from the former telecommunications industry. So simply, cold-joining technology is where a compliant zone of a connector or housing pin is pressed-in to a specific plated through-hole of a printed board. This joint can withstand very tough environmental conditions beyond those usually known for solder joints as long as the overall design is matching. And particularly from the reliability perspective, this is what we needed more in the automotive industry, and that’s why we made this proposal.

A year later my other co-chair, Udo Welzel, and myself got the request from IPC to write a PIN (project initiation request). From this moment onward, we were a very productive working team. After three years we were already in the ballot phase, and in May 2020 finally the standard has been published. I think we have been quite fast considering we started the standard absolutely from scratch.

To read this entire interview, which appeared in the 2021 issue of Show & Tell Magazine, click here.

Share

Print


Suggested Items

Nolan’s Notes: Driving Cost Out of the Supply Chain

04/28/2021 | Nolan Johnson, I-Connect007
Supply chain issues have become mainstream news as virtually all supply chains were affected in some manner by the pandemic lockdowns. The interactions of supply, demand, and distribution became a topic of scrutiny even for my 80-something parents; we all became experts at understanding supply chain when we had to explain exactly why toilet paper was peculiarly absent from store shelves, while there was plenty of liquor still available. The vagaries of the distribution chain for all sorts of daily necessities suddenly became our concern; we no longer could take the supply chain for granted.

Excerpt—The Printed Circuit Assembler’s Guide to... SMT Inspection: Today, Tomorrow, and Beyond, Chapter 3

04/22/2021 | Brent Fischthal, Koh Young America
Initiatives like the IPC Connected Factory Exchange (CFX) and IPC-Hermes-9852 underpin efforts within the industry to develop standards and help create a smart factory. These M2M communication standards, guided in part by Industry 4.0, are altering the manufacturing process by improving metrics such as first pass yield and throughput by applying autonomous process adjustments.

Overcoming Component Selection and Sourcing Challenges

04/14/2021 | John R. Watson, Altium
Most PCB designers know precisely how Captain James T. Kirk felt because we often feel the same way when starting a new design. We are launching into something that we ultimately don't know how it will turn out. We don't know the difficulties we'll face or problems we’ll need to fix. While we can control the design process and use our skills to make reasonable decisions, there are often huge hazards awaiting us in the "unknown." One worsening problem for all designers is component procurement.



Copyright © 2021 I-Connect007. All rights reserved.