BAE Systems Wins $164 Million U.S. Navy Design Contract for Vertical Launch System
May 19, 2021 | BAE SystemsEstimated reading time: 1 minute
BAE Systems, Inc. has won a U.S. Navy competition to serve as the design agent for the mechanical portion of the Mk 41 Vertical Launch System (VLS). With this $164 million award, BAE Systems will provide design and support of the system that is embedded in cruisers and destroyers and launches a wide arsenal of offensive and defensive missiles.
The contract calls for BAE Systems to provide design, development, test, product improvement, and sustaining support for current and legacy VLS systems. BAE Systems will also continue to design and support canisters used to store, transport, and launch the missiles from the VLS.
“This award demonstrates that BAE Systems is an industry leader when it comes to the VLS solution for the Navy’s fleet of Ticonderoga-class cruisers and Arleigh Burke-class destroyers,” said Brent Butcher, vice president of the weapon systems product line at BAE Systems. “Going forward this contract secures our role in providing the Navy with cutting- edge design and engineering supporting this critical warfighting capability.”
The Mk 41 VLS is capable of launching a broad range of missiles, including the Standard Missile SM-2, SM-3, and SM-6 variants; the Tomahawk Land Attack Cruise Missile; the NATO Seasparrow and Evolved Seasparrow; and the Vertical Launch Anti-Submarine Rocket.
The Mk 41 VLS is also deployed with the navies of Australia, Canada, Germany, Japan, the Netherlands, New Zealand, Norway, South Korea, Spain, and Turkey.
Work on this contract begins immediately and will primarily be performed in Minneapolis, Minnesota.
Suggested Items
Reducing Nitrogen Consumption in Convection Soldering with Rehm Thermal Systems' Patented Mechatronic Curtain
03/28/2024 | Rehm Thermal SystemsCurrent developments indicate a need for larger throughput heights due to the trend towards e-mobility, which in turn increases nitrogen consumption for process inertization. Rehm Thermal Systems responds to this issue with an innovative solution: the mechatronic curtain.
Intel Announces New Program for AI PC Software Developers and Hardware Vendors
03/27/2024 | Intel CorporationIntel Corporation announced the creation of two new artificial intelligence (AI) initiatives as part of the AI PC Acceleration Program: the AI PC Developer Program and the addition of independent hardware vendors to the program.
SEMI ESD Alliance 2024 CEO Executive Outlook to Explore the Evolving RISC-V Movement and Semiconductor Design Ecosystem
03/27/2024 | SEMIKey executives from leading semiconductor EDA and IP companies will gather to discuss the latest industry trends, challenges and opportunities Thursday, May 9, in Santa Clara, California at the annual CEO Executive Outlook, hosted by the Electronic System Design Alliance (ESD Alliance), a SEMI Technology Community, and Keysight Technologies. Registration opens soon.
CentraTEQ to Showcase Wide Range of Vibration & Environmental Test Systems at Battery Tech Expo 24
03/26/2024 | CentraTEQEnvironmental and vibration test specialists CentraTEQ are excited to be exhibiting at the upcoming Battery Tech Expo, scheduled to take place at Silverstone on April 25, 2024.
SEMI 3D & Systems Summit To Spotlight Trends In Hybrid Bonding, Chiplet Design And Environmental Sustainability
03/26/2024 | SEMILeading experts in 3D integration and systems for semiconductor manufacturing applications will gather at the annual SEMI 3D & Systems Summit, 12-14 June, 2024,