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Cadence Wins Four 2023 TSMC OIP Partner of the Year Awards

10/20/2023 | Cadence Design Systems, Inc.
Cadence Design Systems, Inc. announced that it has won four Open Innovation Platform® (OIP) Partner of the Year awards from TSMC for its EDA and IP design solutions.

iNEMI & ZESTRON Workshop: Advanced Packaging and its Impact on mm/Wave Applications

10/18/2023 | iNEMI
A workshop sponsored by iNEMI and ZESTRON Corporation will be held on November 7, 2023  at 9:00 a.m.-5:00 p.m.

iNEMI Workshop on Advanced Packaging and Its Impact on mm/Wave Applications

10/13/2023 | ZESTRON
ZESTRON, the leading global provider of high-precision cleaning products, services, and training solutions in the electronics manufacturing and semiconductor industries, is proud to co-sponsor the upcoming workshop, "Advanced Packaging and its Impact on mm/Wave Applications," in collaboration with the International Electronics Manufacturing Initiative (iNEMI).

5G/6G MAESTRO Roadmap on Low Loss Dielectric Materials Characterization Available Online

08/18/2023 | iNEMI
The International Electronics Manufacturing Initiative (iNEMI) announces the availability of the Low Loss Dielectric Materials Characterization Roadmap, which is part of the 5G/6G mmWave Materials and Electrical Test Technology Roadmap (5G/6G MAESTRO).

Ansys Helps Accelerate Development of TMYTEK's Next-Gen mmWave Technology for 5G, Satellite Communications

07/17/2023 | PRNewswire
Leading mmWave technology developer TMY Technology, Inc. (TMYTEK) uses Ansys simulation software to improve the performance, efficiency, and quality of its antenna-in-package (AiP) designs through rapid design verification.
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