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SEMI Applauds CHIPS Program Office Progress to Diversify U.S. Semiconductor Industry Workforce

04/18/2024 | SEMI
The SEMI Foundation, the arm of SEMI dedicated to supporting economic opportunity for workers and the sustained growth of the microelectronics industry by creating pathways and opportunities for job seekers, applauded strides made by the CHIPS Program Office to diversify the U.S. semiconductor industry workforce and its release of the First Annual Report Regarding the Opportunities and Inclusion Activities Undertaken by the Department of Commerce.

Aspocomp’s Q1 Net Sales and Operating Result Decreased YoY

04/18/2024 | Aspocomp
Inflation and interest rates, weak economic development, the uncertainties posed by Russia’s war of aggression and the situation in the Middle East, and global trade policy tensions will affect the operating environment of Aspocomp and its customers in the 2024 fiscal year.

IDTechEx Explores the Role of 3D Cu-Cu Hybrid Bonding in Powering Future HPC and AI Products

04/18/2024 | PRNewswire
Semiconductor packaging has evolved from traditional 1D PCB levels to cutting-edge 3D hybrid bonding at the wafer level, achieving interconnecting pitches as small as single micrometers and over 1000 GB/s bandwidth. Key parameters, including Power, Performance, Area, and Cost, are crucial considerations

SIA Applauds CHIPS Act Incentives for Samsung Manufacturing Projects in Texas

04/16/2024 | SIA
The Semiconductor Industry Association (SIA) released the following statement from SIA President and CEO John Neuffer applauding semiconductor manufacturing incentives announced by the U.S. Department of Commerce and Samsung.

Renesas Commences Operations of Kofu Factory as Dedicated 300-mm Wafer Fab for Power Semiconductors

04/15/2024 | Renesas
Renesas Electronics Corporation, a premier supplier of advanced semiconductor solutions, today announced that it has started operations at its Kofu Factory, located in Kai City, Yamanashi Prefecture, Japan.
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