Quantic Electronics Adds Eulex Components


Reading time ( words)

Quantic Electronics, a portfolio company of Arcline Investment Management, announced the addition of the capacitor technology of Eulex Components, Inc., a leader in the design, development and manufacture of ceramic capacitor components, to its suite of product offerings.

Founded in 2019, Eulex is focused on producing the highest performing, highest quality ceramic capacitors for the most demanding high-frequency, microwave, millimeterwave and 5G applications.

"Eulex brings a wealth of design expertise to our growing portfolio at Quantic," said Ross Sealfon, President and Chief Operating Officer at Quantic Electronics. "Eulex has patented a breakthrough technology enabling ceramic capacitors to achieve higher capacitance while using fewer dielectrics, improving overall temperature and frequency performance. Eulex's unique technology further strengthens our capacitor portfolio in the high and ultra-high frequency ranges."

"Our products deliver design advantages through small-footprint, low-profile packaging, and a wide voltage range. Eulex's products are fully tested up to 50Ghz, and we have a roadmap planned to achieve performance from 6.5 to 100 GHz," said Alex Moalemi, President and co-founder of Eulex Components. "Partnering with Quantic will allow us to rapidly scale our revolutionary capacitor technology enabling Eulex to reach its full potential."

Share




Suggested Items

Kirigami Inspires New Method for Wearable Sensors

10/22/2019 | University of Illinois
As wearable sensors become more prevalent, the need for a material resistant to damage from the stress and strains of the human body’s natural movement becomes ever more crucial. To that end, researchers at the University of Illinois at Urbana-Champaign have developed a method of adopting kirigami architectures to help materials become more strain tolerant and more adaptable to movement.

Worldwide Semiconductor Equipment Billings at $13.3 Billion in 2Q19; Down 20%

09/12/2019 | SEMI
Worldwide semiconductor manufacturing equipment billings reached $13.3 billion in the second quarter of 2019, down 20% from the same quarter of 2018 and 3% from than the previous quarter.

Designing Chips for Real Time Machine Learning

04/01/2019 | DARPA
DARPA’s Real Time Machine Learning (RTML) program seeks to reduce the design costs associated with developing ASICs tailored for emerging ML applications by developing a means of automatically generating novel chip designs based on ML frameworks.



Copyright © 2022 I-Connect007. All rights reserved.