Raytheon Nets US Army IDIQ Contract Award
July 6, 2015 | Raytheon CompanyEstimated reading time: 1 minute
The U.S. Army Contracting Command – Warren recently awarded Raytheon Company the TACOM Strategic Service Solutions (TS3) indefinite delivery/indefinite quantity (IDIQ) contract. The five-year multiple-award vehicle has a ceiling value of $634 million.
The agreement covers future work on sensors, fire control systems, active protection systems, and robotics and autonomous systems for a variety of U.S. Army platforms.
"This contract award represents a major milestone in Raytheon's efforts to deliver vehicle-borne sensors and effectors," said Tom Bussing, vice president of Raytheon's Advanced Missile Systems product line. "Our customer is one of the Army's largest weapon systems research, development and sustainment organizations as well as the center of excellence for the Defense Department in the area of ground vehicles and ground robotics."
This is the first such contract awarded by the Contracting Command to Raytheon Company as a prime contractor. The TS3 contract will be managed in the Raytheon IDIQ Service Center to ensure efficiency and contract optimization by the entire company and its teammates. It is anticipated the majority of the task orders will be performed by Raytheon's Missile Systems business in Tucson.
About Raytheon
Raytheon Company, with 2014 sales of $23 billion and 61,000 employees worldwide, is a technology and innovation leader specializing in defense, civil government and cybersecurity markets throughout the world. With a history of innovation spanning 93 years, Raytheon provides state-of-the-art electronics, mission systems integration and other capabilities in the areas of sensing; effects; and command, control, communications and intelligence systems, as well as cybersecurity and a broad range of mission support services. Raytheon is headquartered in Waltham, Mass. For more about Raytheon, visit us at www.raytheon.com.
Suggested Items
Reducing Nitrogen Consumption in Convection Soldering with Rehm Thermal Systems' Patented Mechatronic Curtain
03/28/2024 | Rehm Thermal SystemsCurrent developments indicate a need for larger throughput heights due to the trend towards e-mobility, which in turn increases nitrogen consumption for process inertization. Rehm Thermal Systems responds to this issue with an innovative solution: the mechatronic curtain.
CentraTEQ to Showcase Wide Range of Vibration & Environmental Test Systems at Battery Tech Expo 24
03/26/2024 | CentraTEQEnvironmental and vibration test specialists CentraTEQ are excited to be exhibiting at the upcoming Battery Tech Expo, scheduled to take place at Silverstone on April 25, 2024.
SEMI 3D & Systems Summit To Spotlight Trends In Hybrid Bonding, Chiplet Design And Environmental Sustainability
03/26/2024 | SEMILeading experts in 3D integration and systems for semiconductor manufacturing applications will gather at the annual SEMI 3D & Systems Summit, 12-14 June, 2024,
iNEMI/IPC White Paper on Complex Integrated Systems Highlights Future Technology and Manufacturing Ecosystem Needs
03/25/2024 | IPCToday’s system solutions combine more varied functionality, such as digital, analog, optical, micro-mechanical, etc., packed into smaller form factors. As a result, electronics manufacturing has to deliver increasingly complex integration of diverse technologies with system designs that blur the distinction between chip, package, board, and assembly.
Synopsys Announces New AI-Driven EDA, IP and Systems Design Solutions At SNUG Silicon Valley
03/25/2024 | PRNewswireSynopsys, Inc. kicked off its annual flagship Synopsys User Group (SNUG) conference in Silicon Valley at the Santa Clara Convention Center with a keynote presentation by Synopsys president and CEO Sassine Ghazi. Ghazi discussed the unprecedented innovation opportunities and challenges that technology R&D teams face in this era of pervasive intelligence.