Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Suggested Items

RiverSide Integrated Solutions, Inc. Celebrating 40 years of Innovation and Excellence

03/21/2024 | RiverSide Integrated Solutions, Inc.
RiverSide Integrated Solutions, Inc., a pioneer in electronic and electromechanical assembly, proudly celebrates the 40th anniversary of the RiverSide name this March.

Save the Date: 2024 NW Electronics Design & Manufacturing Expo (NEDME)

03/19/2024 | NEDME
The Electronics Manufacturers Association of Oregon (EMA) and the Electronics Representatives Association (ERA) are thrilled to announce the 2024 NW Electronics Design & Manufacturing Expo (NEDME), scheduled for October 30th. NEDME is the Pacific Northwest’s premier platform for industry professionals to delve into the latest advancements and trends in electronics manufacturing.

Manu Skyttä, New President and CEO of Aspocomp Group Plc, Will Assume Duties on May 20, 2024

03/19/2024 | Globe Newswire
Manu Skyttä succeeds Mikko Montonen, who, as previously announced, has agreed with the Board of Directors to step down from the role of President and CEO of the company. Mr. Montonen has committed to staying on as the company's President and CEO until May 20, 2024.

Qualcomm Brings the Best of On-Device AI to More Smartphones with Snapdragon 8s Gen 3

03/18/2024 | Qualcomm Technologies, Inc.
Qualcomm Technologies, Inc. announced the Snapdragon® 8s Gen 3 Mobile Platform, delivering the most sought-after 8 series capabilities to more Android flagship smartphones, for extraordinary, premium experiences.

Hitachi High-Tech Launches High-sensitivity and High-throughput Wafer Surface Inspection System LS9300AD for Wafer Manufacturers

03/15/2024 | ACN Newswire
Hitachi High-Tech Corporation announced the launch of the LS9300AD, a new system for inspecting the front and backside of non-patterned wafer surfaces for particles and defects.
Copyright © 2024 I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in