SEMI Launches New Integrated Packaging Assembly and Test Group
February 11, 2016 | SEMIEstimated reading time: 1 minute
SEMI announced today the launch of the European Semiconductor integrated Packaging and Test (ESiPAT) Special Interest Group. The Special Interest Group (SIG) represents SEMI members who have semiconductor packaging, assembly, test manufacturing, or design activities in Europe. The purpose of the SIG is to foster collaboration among companies and to collectively raise the profile and reinforce the semiconductor back-end industry in Europe. Activities will include:
- Maintaining a strong back-end network in Europe
- Increasing awareness between European suppliers and device/packaging manufacturers
- Mapping and reporting capabilities and capacities of European SiPAT members
- Identifying gaps in the European back-end supply chain relative to other regions
- Advocating for the Packaging, Assembly, and Test industry in Europe
- Building project consortia and bidding for European funding
The newly formed executive committee of the SIG includes representatives from AEMTec, First Sensor, NANIUM, RoodMicrotec, Sencio, STMicroelectronics, and Swissbit. More than 20 additional companies from the European back-end supply chain have already expressed interest to join.
Companies meeting the requirements can apply to join the ESiPAT group. SEMI membership and ESiPAT SIG membership dues are required.
About SEMI
SEMI® connects more than 1,900 member companies and more than a quarter-million professionals worldwide to advance the science and business of electronics manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, and services that enable smarter, faster, more powerful, and more affordable electronic products. Since 1970, SEMI has built connections that have helped our members grow more profitably, create new markets, and address common industry challenges together. SEMI maintains offices in Bangalore, Beijing, Berlin, Brussels, Grenoble, Hsinchu, Moscow, San Jose, Seoul, Shanghai, Singapore, Tokyo, and Washington, D.C.
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