FEATURED NEWS AND INFORMATION:

Latest News

Seoul Semiconductor to Launch WICOP TE for Headlamps With Thermal Management Effect for EVs
09/17/2021 | Business Wire
IPC Unveils Golden Gnomes Awards at IPC SummerCom 2021
09/17/2021 | IPC
Ynvisible and PragmatIC Partner to Deliver Flexible Display Modules
09/17/2021 | Business Wire
Panasonic Completes Acquisition of Blue Yonder
09/17/2021 | Business Wire
Tuning Collagen Threads for Biohybrid Robots
09/17/2021 | Emily Schneider, Carnegie Mellon University
Cadence, GlobalFoundries to Qualify Pegasus Verification System
09/17/2021 | Cadence Design Systems, Inc.
PAC INNOVATION RADAR Names Siemens “Best in Class” in Open Digital Platforms
09/17/2021 | Siemens
EU Steps Up 'Semiconductor Sovereignty' Plans
09/16/2021 | IPC
Cadence Accelerates Intelligent SoC Development with Comprehensive On-Device Tensilica AI Platform
09/16/2021 | Cadence Design Systems, Inc.
DuPont Introduces Centers of Excellence for Automotive Electrification
09/16/2021 | DuPont
FEATURED ARTICLES AND COLUMNS:

Averatek Pushing Boundaries of Additive and Semi-Additive Processes

July 12, 2021 | Andy Shaughnessy, Design007 Magazine

At the IEEE International Microwave Symposium show in Atlanta, I met with Tara Dunn, I-Connect007 columnist and VP of marketing and business development for Averatek. We sat down at the show and discussed the past year and a half, and after joking about how we felt like we were on an episode of The Twilight Zone, Tara gave me an update on Averatek’s continuing research into additive and semi-additive technologies.

The Top Five Reasons Products Fail EMI Testing

May 12, 2021 | Kenneth Wyatt, Wyatt Technical Services

The three top product failures that Ken Wyatt sees constantly in his consulting practice are radiated emissions, radiated susceptibility, and electrostatic discharge. After reviewing and testing hundreds of products over the years, he's come to the conclusion that products fail these tests for five common reasons. Read on!

Exciting Advances From NVIDIA’s GPU

May 3, 2021 | Dan Feinberg, I-Connect007

NVIDIA’s Graphics Processing Technology Conference was, as expected, a showcase of new developments, as well as an opportunity for engineers and developers to learn, enhance skills, and discuss new ideas. Just hearing about all the amazing new developments and the accelerating expansion of AI in virtually all aspects of modern society gives those who attended a better idea of just how much AI is and will continue to change their work and our world.

More news...


BOMs and the Supply Chain Featuring:

  • The Bill Comes Due: BOMs and the Digital Twin Interview with Michael Ford
  • A Multi-Tenant PLM Software Solution Interview with George Lewis
  • Whizz is Da BOM Interview with Muhammad Irfan
  • BOM Connector: A Ready-built Solution Interview with Kevin Decker-Weiss and Mark Laing
  • BOMs and the Supply Chain From an Assembler’s Point of View Interview with Duane Benson
  • Luminovo Cuts BOM Waste, Improves OEM/EMS Communication Interview with Sebastian Schaal

Streamlining the Process Featuring:

  • It’s All About Time by Happy Holden
  • Sunstone Streamlining the Process interview with Matt Stevenson
  • Making Process Decisions in a Greenfield by Jessi Hall
  • Altium’s Nexar Platform Unites Design, Supply Chain and Manufacturing interview with Ted Pawela
  • Streamlining the DFM Process: Design Data Transfer Formats by I-Connect007 Research Team
  • Is Your Process Cluttered? Supercharge it! By Todd Kolmodin

Collaboration by Design Featuring:

  • Collaboration by Design, by Andy Shaughnessy 
  • Collaboration: The Key to Streamlining Your Design Process, a conversation with Patrick Davis 
  • PCB Design: It’s a Team Sport, by John Watson 
  • The Power of Designer and Manufacturer Collaboration, by Ian Huibregtse 
  • Collaboration by Design: The Role of EDA Tools, by Rich Tighe 
  • The Collaborative PCB Design Process—A Necessity for Efficient Manufacturing, by Tim Haag 
  • Collaboration to Shorten the Learning Curve, by Tara Dunn
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