Siemens' Analog FastSPICE Certified for UMC's 28nm HPCᵁ+ process technology 03/18/2022 | Siemens
Private LTE/5G Network Deployments to Tenfold in the Next Five Years 03/18/2022 | Berg Insight
Altair Business Responds to Ukraine Crisis 03/17/2022 | Altair
Swissbit Introduces FIDO2 Stick 03/17/2022 | Swissbit
NEC Aims to Produce Highly Accurate, Practical Quantum Annealing Machine 03/17/2022 | ACN Newswire
Yamaha Motor to Donate Humanitarian Aid to Ukraine and Its Surrounding Regions 03/17/2022 | Yamaha Motor Co., Ltd.
Heraeus Electronics Returns to APEC with Presentation on Advanced Interconnection Technologies 03/16/2022 | Heraeus Electronics
Global Semiconductor Materials Market Revenue Tops $64 Billion in 2021 to Set New Record 03/16/2022 | SEMI
Intel Announces Initial Investment of Over €33 Billion for R&D and Manufacturing in EU 03/16/2022 | Intel Corporation
Keysight Introduces New 5G Test Cases in Support of China Mobile’s Carrier Acceptance Test Plan 03/15/2022 | Keysight Technologies, Inc.
Qualcomm, BMW Group and Arriver to Form Long-lasting Strategic Cooperation 03/15/2022 | Qualcomm Technologies, Inc.
Micron Named One of the World’s Most Ethical Companies by Ethisphere 03/15/2022 | Globe Newswire
Worldwide Private LTE/5G Wireless Infrastructure Market Set to Reach $8.3B by 2026 03/15/2022 | IDC
Infineon Boosts IPOSIM Platform with Automated Lifetime Estimation 03/15/2022 | Infineon
SEMI Applauds Findings on Cybersecurity Hardware Adoption in Europe 03/15/2022 | SEMI
Einride Unveils World’s First Remote Pod Operator of Autonomous, Electric Vehicle Fleet 03/14/2022 | Business Wire
IISc Technology Can Address Automotive Chip Shortage in India 03/14/2022 | Indian Institute of Science (IISc)
ATAC, Toyota Establish New Initiative to Support the Social Implementation of Innovative Technologies 03/14/2022 | ACN Newswire
Colorado's Maybell Quantum Exits Stealth; Breakthrough Quantum Hardware to be Made in USA 03/14/2022 | PRNewswire
Memfault Selected for 5G Open Innovation Lab 03/11/2022 | Globe Newswire
White House Meeting Highlights Need for Investments in Domestic Semiconductor Technology 03/11/2022 | SIA
Ynvisible Set to Release the Lowest Energy-Consuming Printed E-Paper Display on the Market 03/11/2022 | Ynvisible Interactive Inc.
Center for Autonomous Robotics Launch in Austin 03/10/2022 | Business Wire
Brain-based Computing Chips Not just for AI Anymore 03/10/2022 | Sandia National Laboratories
SCSK, NEC Strengthen Collaboration to Accelerate Customers' DX and Business Growth 03/10/2022 | ACN Newswire
WHMA Announces 2022 Hall of Fame and Volunteer Excellence Awards 03/10/2022 | IPC
Artificial Retinal Device Mimics Human Optical Illusions: WPI-MANA 03/10/2022 | PRNewswire
Ansys, GlobalFoundries Collaborate to Deliver Next-Gen Silicon Photonics Solutions 03/09/2022 | ANSYS
Nokia, Palo Alto Networks Join 5G Open Innovation Lab 03/09/2022 | Business Wire
Inmarsat Wins Two Railway Technology Excellence Awards 03/09/2022 | Inmarsat
Keysight First to Receive FCC Spectrum Horizons License for Developing 6G Technology in Sub-Terahertz 03/09/2022 | Keysight Technologies
Rochester Electronics Partners with Kyoto Semiconductor 03/09/2022 | ACN Newswire
Maricopa Community Colleges, Intel to Launch Semiconductor Workforce Initiative 03/08/2022 | Intel
Rockwell Automation Suspends Business in Russia 03/08/2022 | Business Wire
Cadence Collaborates with GlobalFoundries to Advance Silicon Photonics IC Design 03/07/2022 | Cadence Design Systems, Inc.
Women in Semiconductors 2022 to Highlight Women in Leadership and STEM Talent Pipeline 03/07/2022 | SEMI
Global Semiconductor Sales Increase 26.8% YoY in January 03/07/2022 | SIA
Samsung Honored for Continued Sustainability Leadership by the U.S. EPA 03/07/2022 | Samsung
Dahua Expands AI Inclusivity with Updated WizSense 03/06/2022 | PRNewswire
IPC APEX EXPO 2022 Show & Tell Magazine Available Now 03/04/2022 | I-Connect007
Microsoft Completes Acquisition of Nuance, Ushering in New Era of Outcomes-based AI 03/04/2022 | PRNewswire
Siemens Investing $54M in Its U.S. Manufacturing Footprint to Support National Infrastructure Projects 03/04/2022 | Business Wire
Analog Devices Invests €100 Million in Europe Operations with ADI Catalyst Launch 03/04/2022 | Analog Devices, Inc.
Intel Statement on the War in Ukraine 03/04/2022 | Intel
SEMICON Southeast Asia 2022 to Focus on Semiconductor Supply Chain Sustainability and Resilience 03/04/2022 | SEMI
Fastweb, Qualcomm Announce Collaboration to Commercialize 5G Standalone mmWave Services in Italy 03/03/2022 | Qualcomm Technologies, Inc.
SIA Echoes President Biden’s Call for Enactment of Investments in Semiconductor Technology 03/03/2022 | SIA
LG Bolsters Leadership in 5G Vehicle Connectivity 03/02/2022 | PRNewswire
In the Future An Entire Car Could Be a Radar Antenna, Says IDTechEx 03/02/2022 | PRNewswire
Standex Acquires Sensor Solutions 03/02/2022 | PRNewswire
Cadence Recognized with TSMC OIP Ecosystem Forum Customers’ Choice Award for 3D-IC Design 03/02/2022 | Cadence Design Systems, Inc.
Samsung Joins Forces with Industry Leaders to Advance 5G vRAN Ecosystem 03/01/2022 | Samsung
Kyoto Semiconductor Partners with Rochester Electronics 03/01/2022 | Kyoto University
SEMI Survey Highlights U.S. Chip Industry Competitiveness, Government Investment 02/28/2022 | SEMI
Keysight, NTT DOCOMO Collaborate to Accelerate Open RAN Ecosystem Maturity 02/28/2022 | Business Wire
5G to Unleash a Digital Revolution to Power Industry 4.0 02/28/2022 | PRNewswire
Cisco Helps Usher in New Era for Mass IoT 02/28/2022 | PRNewswire
Mavenir, Qualcomm Accelerate Next Generation 5G Infrastructure 02/28/2022 | Qualcomm Technologies, Inc.
SIA Statement on Sanctions on Russia 02/28/2022 | SIA
Hewlett Packard Enterprise, Ayar Labs Announce Strategic Collaboration and Investment 02/25/2022 | Business Wire
Intel Advances AI Inferencing for Developers 02/25/2022 | Intel
Viper Networks Completes Acquisition for EcoTech Solutions 02/25/2022 | Globe Newswire
Keysight, Telefonica Join Forces to Advance Transport Networks for Open RAN Deployments 02/25/2022 | Business Wire
Li-Fun, Amionx Sign Manufacturer Agreement for SafeCore 02/24/2022 | PRNewswire
Foxconn Partners With and Invests in XRSPACE to Create Global Metaverse Ecosystem 02/24/2022 | Foxconn
NEC Gears Up 5G xHaul Transformation Services with Automation Ecosystem 02/24/2022 | ACN Newswire
Fujitsu Launches Sustainable 5G vRAN to Deliver Potential Reductions in CO2 Emissions of over 50% 02/24/2022 | ACN Newswire
Database Now Tracks Integrated Device Manufacturers, 475 Facilities 02/23/2022 | SEMI
Black Sesame Technologies Selects Elektrobit AUTOSAR Classic Platform 02/23/2022 | Elektrobit
Radisys Launches 5G IoT Software Suite 02/23/2022 | Business Wire
Siemens Advances Simulation with Simcenter STAR-CCM+, NVIDIA GPU Compute 02/23/2022 | Siemens
Ansys’ OpticStudio STAR Module from Zemax Wins Coveted SPIE Prism Award in Software 02/23/2022 | ANSYS
Affinitiv Launches Electric Vehicle Division, Voltage 02/22/2022 | Business Wire
Fujitsu Delivers New Resource Toolkit to Offer Guidance on Ethical Impact of AI Systems 02/22/2022 | ACN Newswire
HPE, Qualcomm to Deliver the Next-Generation 5G Virtualized Distributed Unit Solutions 02/22/2022 | Qualcomm Technologies, Inc.
NEC's Cloud-Native Converged Core Reaches General Availability 02/22/2022 | ACN Newswire
Intel Reveals Bold Multiyear Xeon Roadmap to Accelerate Data Center Leadership and Growth 02/21/2022 | Intel
Vedanta, Foxconn Sign MOU for Manufacturing Semiconductors in India 02/21/2022 | Foxconn
Finally! A Book About PCB Stackups
‘The Printed Circuit Designer’s Guide to… Stackups: The Design within the Design’ is the latest addition to I-Connect007’s comprehensive, educational library. In this book, brought to readers by Siemens Digital Industries Software and I-007eBooks, author and stackups expert Bill Hargin discusses materials, laminate datasheets, impedance planning, and more. This book provides the reader with a broader understanding of stackup planning and material selection in an effort to comprehend what Hargin calls “the design within the design.”
Portable Generator Powers Small Safety Devices 02/21/2022 | ACN Newswire
KDDI Successfully Turns on the World's First 5G Standalone Open RAN Site Powered by vRAN in Japan 02/18/2022 | JCN Newswire
Keysight, Samsung Sign MoU to Advance Research & Development of 6G Technology 02/18/2022 | Keysight Technologies, Inc.
Broad Coalition Urges Congress to Fund CHIPS Act, Enact Strengthened FABS Act 02/18/2022 | SIA
Altair Acquires Cassini to Accelerate Development of Digital Thread Technology 02/17/2022 | Altair
Ansys Supports LG Electronics to Advance Sustainability, Digital Transformation Efforts 02/17/2022 | ANSYS
Agilent Acquires Artificial Intelligence Technology to Enhance Lab Productivity 02/17/2022 | Business Wire
AMD Completes Acquisition of Xilinx 02/17/2022 | AMD
AdvaMed, SIA Convene Roundtable on Supply Chain Issues 02/17/2022 | SIA
Kyndryl, Nokia Announce Global Network and Edge Computing Alliance 02/17/2022 | PRNewswire
Analog Devices Reports Record Q1 Fiscal 2022 Results 02/16/2022 | Business Wire
European Semiconductor Market Hits Record High in 2021 02/16/2022 | ESIA
Engineers Reveal Cause of Key Sodium-ion Battery Flaw 02/16/2022 | Syl Kacapyr, Cornell University
Noblis Awarded Prime Position on Joint AI Center Contract 02/16/2022 | PRNewswire
Top 5 Robot Trends 2022 02/16/2022 | IFR
India's Smartphone Market Grew by 7% in 2021 02/16/2022 | IDC
DENSO to Take Minority Stake in JASM 02/15/2022 | JCN Newswire
Intel to Acquire Tower Semiconductor for $5.4 Billion 02/15/2022 | Intel
Global Semiconductor Sales, Units Shipped Reach All-Time Highs in 2021 02/15/2022 | SIA
JAXA Selects ArkEdge to Study Navigation, Communication Technology Development 02/15/2022 | JCN Newswire
Brain’s Secret to Lifelong Learning Can Now Come as Hardware for AI 02/14/2022 | Purdue University
