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Current IssueComing to Terms With AI
In this issue, we examine the profound effect artificial intelligence and machine learning are having on manufacturing and business processes. We follow technology, innovation, and money as automation becomes the new key indicator of growth in our industry.
Box Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
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OSI Systems Receives $6 Million Order for Electronic Assemblies
OSI Systems, Inc. announced that its Optoelectronics and Manufacturing division has received an order for approximately $6 million to provide...
Incap Releases Unaudited Business Review for January–March 2024
Revenue for the first quarter 2024 amounted to EUR 51.4 million (1–3/2023: EUR 72.2 million). Year-on-year the revenue decreased 29.3%, as...
Simbe Partners with Plexus to Scale Manufacturing and Meet Global Retail Demand
Simbe, the leading provider of Store Intelligence™ solutions that increase retailer performance through unprecedented visibility and insights,...
Key Tronic Announces Results for Q3 of Fiscal Year 2024
For the third quarter of fiscal year 2024, Key Tronic reported total revenue of $140.5 million, compared to $164.6 million in the same period of...
AIM Solder Signs Shinil Fl Ltd. as New Distributor for Korea
AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce a new distribution...
Symposium on Counterfeit Parts & Materials Program Finalized
The SMTA is pleased to announce the technical program for the Counterfeit Parts & Materials Symposium. Co-organized by SMTA and the Center for...
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Real Time with… IPC APEX EXPO 2024: ASMPT and Technica's Successful Partnership and Future Plans
May 8, 2024 | Real Time with...IPC APEX EXPO
Nolan Johnson speaks with Frank Medina and Jeff Timms about the fruitful collaboration between ASMPT and Technica and the upcoming launch of a machine with enhanced capabilities. They also discuss partnerships with semiconductor firms, customer demo plans, and the significance of the demo center. The conversation highlights the potential in North America.
Real Time with… IPC APEX EXPO 2024: Circuit Board Testing Strategies and the Impact of AI
May 8, 2024 |
Editor Marcy LaRont speaks with Bert Horner, president of The Test Connection, about the importance of strategic planning and design-for-test (DFT). Bert touches on some common mistakes that occur when DFT is not adequately considered early on. The discussion outlines an overarching industry need for a culture shift toward increasingly higher levels of integration and collaboration. Bert mentions that AI now has an influence on testing, as everywhere else, and announces his forthcoming book.
MORE ARTICLES
Nolan’s Notes: Coming to Terms With AI
May 7, 2024 | Nolan Johnson, Nolan's Notes
How fast do things move in the world of data analytics? Here’s an example. We’ve been planning this issue on artificial intelligence for the past few months, and, in fact, I had already written this column about a month ago. Then...
The Knowledge Base: A CM’s Perspective on Box Build Practices
April 30, 2024 | Mike Konrad, The Knowledge Base
In the ever-evolving landscape of electronics manufacturing, the box-build process stands out as a critical phase that bridges the gap between individual component manufacturing and the delivery of a fully functional electronic...
SMT Prospects and Perspectives: AI Opportunities, Challenges, and Possibilities, Part 1
April 17, 2024 | Dr. Jennie Hwang, SMT Perspectives and Prospects
In this installment of my artificial intelligence (AI) series, I will touch on the key foundational technologies that propel and drive the development and deployment of AI, with special consideration of electronics packaging and...
Nolan’s Notes: Do More, Get More
April 2, 2024 | Nolan Johnson, Nolan's Notes
This month in SMT007 Magazine, we’re investigating box build, a manufacturing sector so closely adjacent to board assembly that some OEM customers they’re the same thing. To those of us doing this work, we know they’re very...
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- Using AI to Redefine Productivity with Amin Arbabian, Anders Holden, Raj Vora, and Luis Vidal
- Empowering the Smart Factory Era With AI by Joel Scutchfield and Brent Fischthal
- A Glossary of Artificial Intelligence Terms
- Chiplet Architecture for AI Will Create New Demands for Assembly with Arvind Kumar
- The Rise of Collaborative Intelligence in Manufacturing by Jennifer Davis