Bismuth-based Nanoribbons Show 'Topological' Transport, Potential for New Technologies
January 20, 2016 | Purdue UniversityEstimated reading time: 5 minutes
Researchers have created nanoribbons of an emerging class of materials called topological insulators and used a magnetic field to control their semiconductor properties, a step toward harnessing the technology to study exotic physics and building new spintronic devices or quantum computers.
Unlike ordinary materials that are either insulators or conductors, topological insulators are paradoxically both at the same time - they are insulators inside but conduct electricity on the surface, said Yong P. Chen, a Purdue University associate professor of physics and astronomy and electrical and computer engineering who worked with doctoral student Luis A. Jauregui and other researchers.
The materials might be used for "spintronic" devices and practical quantum computers far more powerful than today's technologies. In the new findings, the researchers used a magnetic field to induce a so-called “helical mode” of electrons, a capability that could make it possible to control the spin state of electrons.
The findings are detailed in a research paper that appeared in the advance online publication of the journal Nature Nanotechnology on Jan. 18 and showed that a magnetic field can be used to induce the nanoribbons to undergo a “topological transition,” switching between a material possessing a band gap on the surface and one that does not.
“Silicon is a semiconductor, meaning it has a band gap, a trait that is needed to switch on and off the conduction, the basis for silicon-based digital transistors to store and process information in binary code,” Chen said. “Copper is a metal, meaning it has no band gap and is always a good conductor. In both cases the presence or absence of a band gap is a fixed property. What is weird about the surface of these materials is that you can control whether it has a band gap or not just by applying a magnetic field, so it’s kind of tunable, and this transition is periodic in the magnetic field, so you can drive it through many ‘gapped’ and ‘gapless’ states.”
The nanoribbons are made of bismuth telluride, the material behind solid-state cooling technologies such as commercial thermoelectric refrigerators.
“Bismuth telluride has been the workhorse material of thermoelectric cooling for decades, but just in the last few years people found this material and related materials have this amazing additional property of being topological insulators,” he said.
Page 1 of 3
Suggested Items
DuPont Showcases AI Innovations Featuring Advanced Interconnects at 2024 International Electronic Circuits Exhibition
05/13/2024 | DuPontDuPont announced it will showcase its comprehensive range of advanced circuit materials and solutions at the 2024 International Electronic Circuits Exhibition in Shanghai. With a product portfolio that includes fine line, signal integrity, power and thermal management, DuPont will exhibit at Booth #8L06 at the National Exhibition and Convention Center (NECC) from May 13 to 15.
MKS’ Atotech to Participate in ECTC
05/10/2024 | MKS’ AtotechAt this year’s 74th IEEE Electronic Components and Technology Conference (ECTC), MKS’ Atotech will present and demonstrate its latest product and service innovations.
The Chemical Connection: Reducing Etch System Water Usage, Part 2
05/02/2024 | Don Ball -- Column: The Chemical ConnectionIn my last column, I reviewed some relatively simple ways to reduce water usage in existing etch systems: cutting down cooling coil water flow, adding chillers to replace plant water for cooling, lowering flow rate nozzles for rinses, etc. This month, I’ll continue with more ways to control water usage in your etcher. Most of these are not easily retrofittable to existing equipment but should be given serious consideration when new equipment is contemplated. With the right combination of add-ons, it is possible to bring the amount of water used in an etch system to almost zero.
Designer’s Notebook: What Designers Need to Know About Manufacturing, Part 2
04/24/2024 | Vern Solberg -- Column: Designer's NotebookThe printed circuit board (PCB) is the primary base element for providing the interconnect platform for mounting and electrically joining electronic components. When assessing PCB design complexity, first consider the component area and board area ratio. If the surface area for the component interface is restricted, it may justify adopting multilayer or multilayer sequential buildup (SBU) PCB fabrication to enable a more efficient sub-surface circuit interconnect.
Insulectro’s 'Storekeepers' Extend Their Welcome to Technology Village at IPC APEX EXPO
04/03/2024 | InsulectroInsulectro, the largest distributor of materials for use in the manufacture of PCBs and printed electronics, welcomes attendees to its TECHNOLOGY VILLAGE during this year’s IPC APEX EXPO at the Anaheim Convention Center, April 9-11, 2024.