Latest Electronics Industry News

Memfault Selected for 5G Open Innovation Lab
03/11/2022 | Globe Newswire
White House Meeting Highlights Need for Investments in Domestic Semiconductor Technology
03/11/2022 | SIA
Ynvisible Set to Release the Lowest Energy-Consuming Printed E-Paper Display on the Market
03/11/2022 | Ynvisible Interactive Inc.
Center for Autonomous Robotics Launch in Austin
03/10/2022 | Business Wire
Brain-based Computing Chips Not just for AI Anymore
03/10/2022 | Sandia National Laboratories
SCSK, NEC Strengthen Collaboration to Accelerate Customers' DX and Business Growth
03/10/2022 | ACN Newswire
WHMA Announces 2022 Hall of Fame and Volunteer Excellence Awards
03/10/2022 | IPC
Artificial Retinal Device Mimics Human Optical Illusions: WPI-MANA
03/10/2022 | PRNewswire
Ansys, GlobalFoundries Collaborate to Deliver Next-Gen Silicon Photonics Solutions
03/09/2022 | ANSYS
Nokia, Palo Alto Networks Join 5G Open Innovation Lab
03/09/2022 | Business Wire
Inmarsat Wins Two Railway Technology Excellence Awards
03/09/2022 | Inmarsat
Keysight First to Receive FCC Spectrum Horizons License for Developing 6G Technology in Sub-Terahertz
03/09/2022 | Keysight Technologies
Rochester Electronics Partners with Kyoto Semiconductor
03/09/2022 | ACN Newswire
Maricopa Community Colleges, Intel to Launch Semiconductor Workforce Initiative
03/08/2022 | Intel
Rockwell Automation Suspends Business in Russia
03/08/2022 | Business Wire
Cadence Collaborates with GlobalFoundries to Advance Silicon Photonics IC Design
03/07/2022 | Cadence Design Systems, Inc.
Women in Semiconductors 2022 to Highlight Women in Leadership and STEM Talent Pipeline
03/07/2022 | SEMI
Global Semiconductor Sales Increase 26.8% YoY in January
03/07/2022 | SIA
Samsung Honored for Continued Sustainability Leadership by the U.S. EPA
03/07/2022 | Samsung
Dahua Expands AI Inclusivity with Updated WizSense
03/06/2022 | PRNewswire
IPC APEX EXPO 2022 Show & Tell Magazine Available Now
03/04/2022 | I-Connect007
Microsoft Completes Acquisition of Nuance, Ushering in New Era of Outcomes-based AI
03/04/2022 | PRNewswire
Siemens Investing $54M in Its U.S. Manufacturing Footprint to Support National Infrastructure Projects
03/04/2022 | Business Wire
Analog Devices Invests €100 Million in Europe Operations with ADI Catalyst Launch
03/04/2022 | Analog Devices, Inc.
Intel Statement on the War in Ukraine
03/04/2022 | Intel
SEMICON Southeast Asia 2022 to Focus on Semiconductor Supply Chain Sustainability and Resilience
03/04/2022 | SEMI
Fastweb, Qualcomm Announce Collaboration to Commercialize 5G Standalone mmWave Services in Italy
03/03/2022 | Qualcomm Technologies, Inc.
SIA Echoes President Biden’s Call for Enactment of Investments in Semiconductor Technology
03/03/2022 | SIA
LG Bolsters Leadership in 5G Vehicle Connectivity
03/02/2022 | PRNewswire
In the Future An Entire Car Could Be a Radar Antenna, Says IDTechEx
03/02/2022 | PRNewswire


Standex Acquires Sensor Solutions
03/02/2022 | PRNewswire
Cadence Recognized with TSMC OIP Ecosystem Forum Customers’ Choice Award for 3D-IC Design
03/02/2022 | Cadence Design Systems, Inc.
Samsung Joins Forces with Industry Leaders to Advance 5G vRAN Ecosystem
03/01/2022 | Samsung
Kyoto Semiconductor Partners with Rochester Electronics
03/01/2022 | Kyoto University
SEMI Survey Highlights U.S. Chip Industry Competitiveness, Government Investment
02/28/2022 | SEMI
Keysight, NTT DOCOMO Collaborate to Accelerate Open RAN Ecosystem Maturity
02/28/2022 | Business Wire
5G to Unleash a Digital Revolution to Power Industry 4.0
02/28/2022 | PRNewswire
Cisco Helps Usher in New Era for Mass IoT
02/28/2022 | PRNewswire
Mavenir, Qualcomm Accelerate Next Generation 5G Infrastructure
02/28/2022 | Qualcomm Technologies, Inc.
SIA Statement on Sanctions on Russia
02/28/2022 | SIA
Hewlett Packard Enterprise, Ayar Labs Announce Strategic Collaboration and Investment
02/25/2022 | Business Wire
Intel Advances AI Inferencing for Developers
02/25/2022 | Intel
Viper Networks Completes Acquisition for EcoTech Solutions
02/25/2022 | Globe Newswire
Keysight, Telefonica Join Forces to Advance Transport Networks for Open RAN Deployments
02/25/2022 | Business Wire
Li-Fun, Amionx Sign Manufacturer Agreement for SafeCore
02/24/2022 | PRNewswire
Foxconn Partners With and Invests in XRSPACE to Create Global Metaverse Ecosystem
02/24/2022 | Foxconn
NEC Gears Up 5G xHaul Transformation Services with Automation Ecosystem
02/24/2022 | ACN Newswire
Fujitsu Launches Sustainable 5G vRAN to Deliver Potential Reductions in CO2 Emissions of over 50%
02/24/2022 | ACN Newswire
Database Now Tracks Integrated Device Manufacturers, 475 Facilities
02/23/2022 | SEMI
Black Sesame Technologies Selects Elektrobit AUTOSAR Classic Platform
02/23/2022 | Elektrobit
Radisys Launches 5G IoT Software Suite
02/23/2022 | Business Wire
Siemens Advances Simulation with Simcenter STAR-CCM+, NVIDIA GPU Compute
02/23/2022 | Siemens
Ansys’ OpticStudio STAR Module from Zemax Wins Coveted SPIE Prism Award in Software
02/23/2022 | ANSYS
Affinitiv Launches Electric Vehicle Division, Voltage
02/22/2022 | Business Wire
Fujitsu Delivers New Resource Toolkit to Offer Guidance on Ethical Impact of AI Systems
02/22/2022 | ACN Newswire
HPE, Qualcomm to Deliver the Next-Generation 5G Virtualized Distributed Unit Solutions
02/22/2022 | Qualcomm Technologies, Inc.
NEC's Cloud-Native Converged Core Reaches General Availability
02/22/2022 | ACN Newswire
Intel Reveals Bold Multiyear Xeon Roadmap to Accelerate Data Center Leadership and Growth
02/21/2022 | Intel
Vedanta, Foxconn Sign MOU for Manufacturing Semiconductors in India
02/21/2022 | Foxconn

Finally! A Book About PCB Stackups

‘The Printed Circuit Designer’s Guide to… Stackups: The Design within the Design’ is the latest addition to I-Connect007’s comprehensive, educational library. In this book, brought to readers by Siemens Digital Industries Software and I-007eBooks, author and stackups expert Bill Hargin discusses materials, laminate datasheets, impedance planning, and more. This book provides the reader with a broader understanding of stackup planning and material selection in an effort to comprehend what Hargin calls “the design within the design.”


Portable Generator Powers Small Safety Devices
02/21/2022 | ACN Newswire
KDDI Successfully Turns on the World's First 5G Standalone Open RAN Site Powered by vRAN in Japan
02/18/2022 | JCN Newswire
Keysight, Samsung Sign MoU to Advance Research & Development of 6G Technology
02/18/2022 | Keysight Technologies, Inc.
Broad Coalition Urges Congress to Fund CHIPS Act, Enact Strengthened FABS Act
02/18/2022 | SIA
Altair Acquires Cassini to Accelerate Development of Digital Thread Technology
02/17/2022 | Altair
Ansys Supports LG Electronics to Advance Sustainability, Digital Transformation Efforts
02/17/2022 | ANSYS
Agilent Acquires Artificial Intelligence Technology to Enhance Lab Productivity
02/17/2022 | Business Wire
AMD Completes Acquisition of Xilinx
02/17/2022 | AMD
AdvaMed, SIA Convene Roundtable on Supply Chain Issues
02/17/2022 | SIA
Kyndryl, Nokia Announce Global Network and Edge Computing Alliance
02/17/2022 | PRNewswire
Analog Devices Reports Record Q1 Fiscal 2022 Results
02/16/2022 | Business Wire
European Semiconductor Market Hits Record High in 2021
02/16/2022 | ESIA
Engineers Reveal Cause of Key Sodium-ion Battery Flaw
02/16/2022 | Syl Kacapyr, Cornell University
Noblis Awarded Prime Position on Joint AI Center Contract
02/16/2022 | PRNewswire
Top 5 Robot Trends 2022
02/16/2022 | IFR
India's Smartphone Market Grew by 7% in 2021
02/16/2022 | IDC
DENSO to Take Minority Stake in JASM
02/15/2022 | JCN Newswire
Intel to Acquire Tower Semiconductor for $5.4 Billion
02/15/2022 | Intel
Global Semiconductor Sales, Units Shipped Reach All-Time Highs in 2021
02/15/2022 | SIA
JAXA Selects ArkEdge to Study Navigation, Communication Technology Development
02/15/2022 | JCN Newswire
Brain’s Secret to Lifelong Learning Can Now Come as Hardware for AI
02/14/2022 | Purdue University
Study: Possibilities for Triggering Room-Temperature Superconductivity with Light
02/14/2022 | Stanford University
Vodafone UK Taps Oracle Tech to Support 5G Network Core
02/14/2022 | PRNewswire
Trends in worldwide semiconductor production capacity
02/14/2022 | ESIA
Autonomous Movers Set for U.S. Launch in 2024
02/14/2022 | Business Wire
ESIA Welcomes the European Chips Act
02/11/2022 | ESIA
Smart Manufacturing Spend Climbs Over $950B in 2030
02/11/2022 | PRNewswire
Intel Foundry Services Launches Ecosystem Alliance to Accelerate Customer Innovation
02/11/2022 | Intel
Ansys Bridges the Engineering Industry Skills Gap with Flourishing Academic Program
02/11/2022 | ANSYS
Siemens Adds Intelligence-based Design to Xcelerator Portfolio with Latest Release of NX
02/10/2022 | Siemens


Showa Denko Accelerates Search for Optimal Formulation of Semiconductor Materials
02/10/2022 | ACN Newswire
TT Electronics, ZapCarbon ‘Healthy Home Sensor’ Collaboration Shortlisted for IoT Social Impact
02/10/2022 | TT Electronics
Operator 5G Engagements Up by Over 50%
02/10/2022 | Business Wire
Ansys Joins Intel Foundry Services’ Design Ecosystem Alliance as an Inaugural Member
02/10/2022 | ANSYS
SIA Launches Semiconductor Unit Sales Dashboard
02/10/2022 | Robert Casanova, SIA
GlobalFoundries Reports 36% Revenue Growth in FY2021
02/09/2022 | GlobalFoundries
Cambridge Awarded €1.9M to Stop AI Undermining ‘Core Human Values’
02/09/2022 | University of Cambridge
SEMI: Worldwide Silicon Wafer Shipments, Revenue Set New Records in 2021
02/09/2022 | SEMI
H3 Dynamics Launches Autonomous Drone Stations to Help Monitor Large Solar Farms
02/08/2022 | Business Wire
Data Society Joins NVIDIA Partner Network, Deep Learning Institute
02/08/2022 | Business Wire
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