Practical Components to Debut Advanced Technologies at IWLPC
September 24, 2019 | Practical ComponentsEstimated reading time: 1 minute
Practical Components will exhibit in booth 31 at the 2019 International Wafer-Level Packaging Conference (IWLPC) from October 22-23, 2019 at DoubleTree by Hilton in San Jose, California. Practical Components has added many new test wafers for miniaturized surface mount technology (SMT) to its array of dummy components, solder training kits and PCB evaluation kits.
New at this year's conference, Practical will introduce the MB6020-0102JY advanced test wafer, which is the most challenging wafer to date. This 8" wafer contains 3.0mm daisy chained chips that enable users to experiment and refine the process with pad pitches of 60/55/50/45/40/35/30/25/and 20μm on each chip.
Also new this year is the Practical IPC/WHMA-A-620 Space Addendum Wire Harness Cable Training Kit. IPC/WHMA-A-620C-S provides additional requirements to IPC/WHMA-A-620C to ensure the reliability of cable and wire harness assemblies that must survive the vibration and thermal cyclic environments getting to and operating in space. The IPC/WHMA-A-620C-S space addendum kit is to be used in conjunction with the Practical IPC/WHMA-A-620 kit.
Practical Components also will feature Dummy Amkor eWLP-Wafers .4-CuPd-DC-NB 8" wafer-embedded copper pads, Dummy Amkor CSPnl-Wafers .4-DC-SAC405 8" wafers with SAC405 ball daisy-chained 0.4 mm pitch, Amkor 0.3 mm CVBGA and Test Vehicle and Jabil Solder Paste Evaluation Board and Kit.
Practical has supplies for all of today's essential technologies as well the products needed for companies to advance their products, technologies, processes and understanding into the future.
IWLPC brings together the semiconductor industry's most respected authorities addressing all aspects of Wafer-Level Packaging, 3D and Advanced Manufacturing and Test. Going into its 16th year the IWLPC is co-produced by Chip Scale Review, the leading international magazine addressing the semiconductor packaging industry and SMTA, the distinguished global association in electronic assembly and manufacturing.
To learn more about Practical Components’ product offerings and capabilities, stop by booth 31 at IWLPC or visit www.practicalcomponents.com.
About Practical Components
Practical Components is a team of dedicated electronics industry professionals offering value pricing, on-time delivery, and superior service to customers. The Practical Components team is ready to provide project assistance in the areas of technical component knowledge, drawings, component land patterns and PCB practice kits.
Suggested Items
Taiyo Circuit Automation Installs New DP3500 into Fuba Printed Circuits, Tunisia
04/25/2024 | Taiyo Circuit AutomationTaiyo Circuit Automation is proud to be partnered with Fuba Printed Circuits, Tunisia part of the OneTech Group of companies, a leading printed circuit board manufacturer based out of Bizerte, Tunisia, on their first installation of Taiyo Circuit Automation DP3500 coater.
Vicor Power Orders Hentec Industries/RPS Automation Pulsar Solderability Testing System
04/24/2024 | Hentec Industries/RPS AutomationHentec Industries/RPS Automation, a leading manufacturer of selective soldering, lead tinning and solderability test equipment, is pleased to announce that Vicor Power has finalized the purchase of a Pulsar solderability testing system.
AIM Solder’s Dillon Zhu to Present on Ultraminiature Soldering at SMTA China East
04/22/2024 | AIMAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce that Dillon Zhu will present on the topic: Ultraminiature Soldering: Techniques, Technologies, and Standards at SMTA China East. This event is being held at the Shanghai World Expo Exhibition & Convention Center from April 24-25.
AIM to Highlight NC259FPA Ultrafine No Clean Solder Paste at SMTA Wisconsin Expo & Tech Forum
04/18/2024 | AIMAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming SMTA Wisconsin Expo & Tech Forum taking place on May 7 at the Four Points by Sheraton | Milwaukee Airport, in Milwaukee, Wisconsin.
Hentec/RPS Publishes an Essential Guide to Selective Soldering Processing Tech Paper
04/17/2024 | Hentec Industries/RPS AutomationHentec Industries/RPS Automation, a leading manufacturer of selective soldering, lead tinning and solderability test equipment, announces that it has published a technical paper describing the critical process parameters that need to be optimized to ensure optimal results and guarantee the utmost in end-product quality.