Ansys Receives 2021 TSMC OIP Partner of the Year Awards for Next-Generation Design Enablement
November 24, 2021 | ANSYSEstimated reading time: 2 minutes
Ansys has been recognized by TSMC as a recipient of two 2021 OIP Partner of the Year awards for Joint Development of 4nm Design Infrastructure and Joint Development of 3DFabric™ Design Solution. The Partner of the Year award honors TSMC Open Innovation Platform® (OIP) ecosystem partners’ pursuit of excellence in next-generation design enablement over the past year. Ansys and other OIP ecosystem partners’ collaborative efforts effectively promote innovation in the semiconductor industry. TSMC announced award winners at its 2021 OIP Ecosystem Forum, a one-of-a-kind event that brings together the semiconductor design ecosystem partners and TSMC customers, providing an ideal platform to discuss the latest technologies and design solutions for HPC, mobile, automotive, and IoT applications.
Ansys provides a broad range of multiphysics analysis tools that help address matters that have become increasingly central concerns for advanced semiconductor manufacturing. Traditional signoff analyses, like voltage drop and electromigration, become more acute at 3nm and N4 technologies as the number of transistors grows, the complexity increases, and ultra-low supply voltages lead to vanishing safety margins. Ansys secured an award in the category of Joint Development of 4nm Design Infrastructure for working closely with TSMC on these issues leading to the certification of Ansys RedHawk-SC™ and Ansys Totem™ for TSMC’s most advanced 3nm and N4 processes.
TSMC 3DFabric technologies provide the industry with a solution for greater integration density. Realizing the advantages of 3DFabric requires not only higher capacity analysis platforms but also the integration of new physics into the design process. Ansys earned an award in the category of Joint Development of 3DFabric™ Design Solution for Ansys RedHawk-SC Electrothermal™ development on for full chip-and-package thermal analysis.
“Congratulations to Ansys as the winner of the 2021 TSMC OIP Partner of the Year awards,” said Suk Lee, vice president of Design Infrastructure Management Division at TSMC. “Your continuous collaboration and effort make us able to be at the forefront of technology development, while enabling our customers to take full advantage of the significant power, performance, and area improvements of TSMC’s advanced technologies to accelerate innovation for their differentiated products.”
“TSMC is one of the foremost technology developers in the entire semiconductor industry and working closely with TSMC has been a critical factor in the success of our signoff technology products,” said John Lee, vice president and general manager of Electronics and Semiconductor Business Unit at Ansys. “Thanks to this close collaboration, our joint customers are able to use Ansys tools with confidence on the most challenging and advanced single and multi-die design projects in the industry.”
The title of OIP Partner of the Year is awarded to partner companies working relentlessly to achieve the highest standards of design, development, and technology implementation. Ansys will continue working with TSMC to enable next generation designs and recently presented a paper on thermal analysis of 3DFabric designs at this year’s TSMC OIP Ecosystem Forum: “A Comprehensive Hierarchical Thermal Solution for Advanced 3DIC System” by Norman Chang et al.
Suggested Items
iNEMI Packaging Tech Topic Series: Role of EDA in Advanced Semiconductor Packaging
04/26/2024 | iNEMIAdvanced semiconductor packaging with heterogenous integration has made on-package integration of multiple chips a crucial part of finding alternatives to transistor scaling. Historically, EDA tools for front-end and back-end design have evolved separately; however, design complexity and the increased number of die-to-die or die-to-substrate interconnections has led to the need for EDA tools that can support integration of overall design planning, implementation, and system analysis in a single cockpit.
Cadence, TSMC Collaborate on Wide-Ranging Innovations to Transform System and Semiconductor Design
04/25/2024 | Cadence Design SystemsCadence Design Systems, Inc. and TSMC have extended their longstanding collaboration by announcing a broad range of innovative technology advancements to accelerate design, including developments ranging from 3D-IC and advanced process nodes to design IP and photonics.
Ansys, TSMC Enable a Multiphysics Platform for Optics and Photonics, Addressing Needs of AI, HPC Silicon Systems
04/25/2024 | PRNewswireAnsys announced a collaboration with TSMC on multiphysics software for TSMC's Compact Universal Photonic Engines (COUPE). COUPE is a cutting-edge Silicon Photonics (SiPh) integration system and Co-Packaged Optics platform that mitigates coupling loss while significantly accelerating chip-to-chip and machine-to-machine communication.
Siemens’ Breakthrough Veloce CS Transforms Emulation and Prototyping with Three Novel Products
04/24/2024 | Siemens Digital Industries SoftwareSiemens Digital Industries Software launched the Veloce™ CS hardware-assisted verification and validation system. In a first for the EDA (Electronic Design Automation) industry, Veloce CS incorporates hardware emulation, enterprise prototyping and software prototyping and is built on two highly advanced integrated circuits (ICs) – Siemens’ new, purpose-built Crystal accelerator chip for emulation and the AMD Versal™ Premium VP1902 FPGA adaptive SoC (System-on-a-chip) for enterprise and software prototyping.
Listen Up! The Intricacies of PCB Drilling Detailed in New Podcast Episode
04/25/2024 | I-Connect007In episode 5 of the podcast series, On the Line With: Designing for Reality, Nolan Johnson and Matt Stevenson continue down the manufacturing process, this time focusing on the post-lamination drilling process for PCBs. Matt and Nolan delve into the intricacies of the PCB drilling process, highlighting the importance of hole quality, drill parameters, and design optimization to ensure smooth manufacturing. The conversation covers topics such as drill bit sizes, aspect ratios, vias, challenges in drilling, and ways to enhance efficiency in the drilling department.