U.S. Air Force Selects SAIC For $99 Million Weapons Simulation Technology Contract
December 15, 2021 | SAICEstimated reading time: 1 minute
Science Applications International Corp. was awarded a contract valued at $99 million by the U.S. Air Force. The Weapon Engagement Simulation Technology for Advanced Research (WESTAR) program, within the Air Force Research Laboratory, will continue developing modeling capabilities to assist in the research, development and transition of Air Force weapon systems.
Under the five-year, single-award indefinite-delivery/indefinite-quantity contract, SAIC will help the U.S. Air Force Research Laboratory develop multi-spectral and multi-modal phenomenology modeling capabilities, advance the state-of-the-art of software/hardware-in-the-loop test technology, and perform a critical role in the research, development and transition of Air Force munitions. Use of simulation at all levels of munition development will serve as a key component of this research.
“SAIC has partnered with the Air Force Research Laboratory since 2000 to support next-generation weapon system development, and we are pleased that our past success positioned us as a valuable partner for the WESTAR program,” said Michael LaRouche, president of SAIC’s National Security and Space Sector. “Our domain experience and innovative approach is helping the U.S. Air Force develop technology for test and evaluation of complex weapon systems that will deter and defeat future threats.”
The contract calls on SAIC to provide a cohesive research strategy to conduct basic, applied and advanced technology demonstration that furthers the Air Force science and technology strategy known as AF Vision 2030.
Suggested Items
Warm Windows and Streamlined Skin Patches – IDTechEx Explores Flexible and Printed Electronics
04/26/2024 | IDTechExFlexible and printed electronics can be integrated into cars and homes to create modern aesthetics that are beneficial and easy to use. From luminous car controls to food labels that communicate the quality of food, the uses of this technology are endless and can upgrade many areas of everyday life.
iNEMI Packaging Tech Topic Series: Role of EDA in Advanced Semiconductor Packaging
04/26/2024 | iNEMIAdvanced semiconductor packaging with heterogenous integration has made on-package integration of multiple chips a crucial part of finding alternatives to transistor scaling. Historically, EDA tools for front-end and back-end design have evolved separately; however, design complexity and the increased number of die-to-die or die-to-substrate interconnections has led to the need for EDA tools that can support integration of overall design planning, implementation, and system analysis in a single cockpit.
Koh Young Showcases Award-winning Inspection Solutions at SMTconnect with SmartRep in Hall 4A.225
04/25/2024 | Koh Young TechnologyKoh Young Technology, the industry leader in True 3D measurement-based inspection solutions, will showcase an array of award-winning inspection and measurement solutions at SMTconnect alongside its sales partner, SmartRep, in booth 4A.225 at NürnbergMesse from June 11-13, 2023. The following offers a glimpse into what Koh Young will present at the tradeshow:
Real Time with… IPC APEX EXPO 2024: Plasmatreat: Innovative Surface Preparation Solutions
04/25/2024 | Real Time with...IPC APEX EXPOIn this interview, Editor Nolan Johnson speaks with Hardev Grewal, CEO and president of Plasmatreat, a developer of atmospheric plasma solutions. Plasmatreat uses clean compressed air and electricity to create plasma, offering environmentally friendly methods for surface preparation. Their technology measures plasma density for process optimization and can remove organic micro-contamination. Nolan and Hardev also discuss REDOX-Tool, a new technology for removing metal oxides.
Nanotechnology Market to Surpass $53.51 Billion by 2031
04/25/2024 | PRNewswireSkyQuest projects that the nanotechnology market will attain a value of USD 53.51 billion by 2031, with a CAGR of 36.4% over the forecast period (2024-2031).