Thales Launches New IoT Connectivity Solution with Improved Reliability, Security for Smart Devices
February 3, 2022 | ThalesEstimated reading time: 1 minute
Thales delivers innovative IoT technology that simplifies companies’ digital transformation. For more than twenty years, our customers – in a wide range of industries - trust Thales’ IoT solutions to seamlessly connect and secure their devices. The launch of the ELS62 series fits Thales’ 360° approach1 and provides cost-effective solutions to simplify design, streamline development and accelerate time-to-market for IoT solutions.
The IoT industry requires both highly stable connectivity and devices secured by-design to unleash its full potential and win users’ trust. That’s how Thales came up with a single antenna solution - compliant with LTE-Cat.1bis standard2 - to offer flexible connectivity options and strong cybersecurity to IoT device manufacturers. Its optimized size enables to address smaller but still sensitive objects, such as medical wearables, smart meters, home alarm systems or any other devices used in critical use cases. In fact, the ELS62 module integrates security features to protect both the device and data, by ensuring robustness against cyberattacks, with strong device authentication and data encryption.
In addition, device management is streamlined thanks to Thales’ leading expertise in remote device activation and connectivity management3. Indeed, Thales’ 2G connectivity fall-back service maximizes network reachability and improves users’ quality of service. This means savings, not just at installation, but also over the device’s lifecycle as it removes the need for physical servicing (leading to a reduced total-cost of ownership).
Suggested Items
iNEMI Packaging Tech Topic Series: Role of EDA in Advanced Semiconductor Packaging
04/26/2024 | iNEMIAdvanced semiconductor packaging with heterogenous integration has made on-package integration of multiple chips a crucial part of finding alternatives to transistor scaling. Historically, EDA tools for front-end and back-end design have evolved separately; however, design complexity and the increased number of die-to-die or die-to-substrate interconnections has led to the need for EDA tools that can support integration of overall design planning, implementation, and system analysis in a single cockpit.
Cadence, TSMC Collaborate on Wide-Ranging Innovations to Transform System and Semiconductor Design
04/25/2024 | Cadence Design SystemsCadence Design Systems, Inc. and TSMC have extended their longstanding collaboration by announcing a broad range of innovative technology advancements to accelerate design, including developments ranging from 3D-IC and advanced process nodes to design IP and photonics.
Ansys, TSMC Enable a Multiphysics Platform for Optics and Photonics, Addressing Needs of AI, HPC Silicon Systems
04/25/2024 | PRNewswireAnsys announced a collaboration with TSMC on multiphysics software for TSMC's Compact Universal Photonic Engines (COUPE). COUPE is a cutting-edge Silicon Photonics (SiPh) integration system and Co-Packaged Optics platform that mitigates coupling loss while significantly accelerating chip-to-chip and machine-to-machine communication.
Siemens’ Breakthrough Veloce CS Transforms Emulation and Prototyping with Three Novel Products
04/24/2024 | Siemens Digital Industries SoftwareSiemens Digital Industries Software launched the Veloce™ CS hardware-assisted verification and validation system. In a first for the EDA (Electronic Design Automation) industry, Veloce CS incorporates hardware emulation, enterprise prototyping and software prototyping and is built on two highly advanced integrated circuits (ICs) – Siemens’ new, purpose-built Crystal accelerator chip for emulation and the AMD Versal™ Premium VP1902 FPGA adaptive SoC (System-on-a-chip) for enterprise and software prototyping.
Listen Up! The Intricacies of PCB Drilling Detailed in New Podcast Episode
04/25/2024 | I-Connect007In episode 5 of the podcast series, On the Line With: Designing for Reality, Nolan Johnson and Matt Stevenson continue down the manufacturing process, this time focusing on the post-lamination drilling process for PCBs. Matt and Nolan delve into the intricacies of the PCB drilling process, highlighting the importance of hole quality, drill parameters, and design optimization to ensure smooth manufacturing. The conversation covers topics such as drill bit sizes, aspect ratios, vias, challenges in drilling, and ways to enhance efficiency in the drilling department.