Nokia, Palo Alto Networks Join 5G Open Innovation Lab
March 9, 2022 | Business WireEstimated reading time: 2 minutes
Nokia and Palo Alto Networks have joined the 5G Open Innovation Lab as the newest corporate partners. The 5G OI Lab has uniquely pioneered an open innovation model that brings together influential startups, global tech platform leaders, industry partners, and investors to connect and collaborate. Its thesis focuses on uncovering enterprise ready use cases exploiting the transformative potential of 5G and edge computing.
The Lab also announced the 12 multi-stage startups chosen to participate in its fifth batch of the select program, getting underway this week.
5G OI Lab partners including Intel, Microsoft, T-Mobile, Dell Technologies, Amdocs, VMware, Avanade, F5, Spirent, Ericsson, and CNH Industrial work together and directly with Lab startups to provide business and technical mentorship, and collaborate on potential proof of concept, go to market, and other opportunities.
Jim Brisimitzis, Founder and Managing Partner of the 5G Open Innovation Lab, said: “Our partner-first approach to collaborative innovation has helped the Lab standout globally. We are humbled to have Nokia and Palo Alto Networks join our ecosystem. Working with our other partners and startups, Nokia and Palo Alto Networks significantly expand the opportunities and potential to unleash the power and true value of edge and 5G enabled connectivity.
Ed Alfonso, EVP and GM of Nokia America’s Mobile Networks, said: “5G’s lightning-fast speed and ultra-low latency are game changers for wireless connectivity and the plethora of new industry applications it can enable. What’s also game changing is how 5G will reach its full potential – which will be achieved through partnerships with industry, academia and government and through ecosystems such as those that 5G Open Innovation Lab has created. Working together, we can prove out new 5G and edge use cases and collaborate directly with the startup community that is dreaming up even bigger applications for 5G. Nokia is dedicated to participating in 5G OI Lab’s programs with our industry-leading 5G technology and experts.”
Keith O’Brien, CTO Service Providers for Palo Alto Networks, said: “How we dream and develop the next applications and innovations for 5G cannot be done without security considerations and requirements, like securing network slices and multi-access edge computing, for those innovations and applications baked in from the start. Palo Alto Networks is excited to join the 5G Open Innovation Lab to help these innovative startups to embrace cybersecurity as an enabler of their success and mentor them as they bring these next gen capabilities securely to market.”
Suggested Items
The New Industry: Will the Growth Continue?
04/30/2024 | I-Connect007 Editorial TeamHow sustainable are the primary financial models in the United States regarding PCB fabrication shops? In this interview with economic experts Shawn DuBravac and Tom Kastner, we explore what’s happening with U.S. printed circuit board shops in today’s market, how consolidation affects the industry, and what can be done.
TTM’s High Tech Expansion and Industry Innovation
04/30/2024 | Marcy LaRont, PCB007 MagazineTom Edman has been the CEO of TTM Technologies since 2014 and has an extensive background in electronics and manufacturing. TTM is a leading global manufacturer of technology solutions, including mission systems, RF component and RF microwave microelectronics assemblies, and quick turn and advanced technology printed circuit boards.
U.S. Companies Invest Heavily in Robots
04/30/2024 | IFRManufacturing companies in the United States have invested heavily in more automation: total installations of industrial robots rose by 12% and reached 44,303 units in 2023. Number one adopter is the car industry followed by the electrical and electronics sector.
USPAE to Springboard U.S. Technology Forward
04/30/2024 | Marcy LaRont, PCB007 MagazineThe U.S. Partnership for Assured Electronics (USPAE) was launched as a nonprofit subsidiary of IPC in 2020, specifically to manage the DoD relationship and access to funding, and to develop a cooperative facility to develop UHDI capabilities in the U.S., not only for the defense sector, but for the whole of the U.S. electronics industry. It is a tall order, but industry veteran Joe O'Neil believes it will happen. Having been tasked with making the UHDI Capable Cooperative Production Facility (UCCPF) a reality, he provides an update on this important project for U.S. electronics manufacturing.
Samsung Electronics Begins Industry’s First Mass Production of 9th-Gen V-NAND
04/29/2024 | Samsung ElectronicsSamsung Electronics, the world leader in advanced memory technology, today announced that it has begun mass production for its one-terabit (Tb) triple-level cell (TLC) 9th-generation vertical NAND (V-NAND), solidifying its leadership in the NAND flash market.