Siemens' Analog FastSPICE Certified for UMC's 28nm HPC?+ process technology
March 18, 2022 | SiemensEstimated reading time: 1 minute
Siemens Digital Industries Software announced that its Analog FastSPICE (AFS) platform is now certified for United Microelectronics Corporation’s (UMC) 28nm high-performance, low-power process technology. With this certification, customers using Siemens‘ AFS platform can now leverage the performance enhancement and power efficiency of UMC‘s proven 28HPC U+ process for their next-generation analog/mixed-signal designs.
“We continue to have a strong collaboration with UMC to provide comprehensive support for UMC’s process technologies for our mutual customers,” said Ravi Subramanian, senior vice president and general manager of IC Verification Solutions, Siemens Digital Industries Software. “Our Analog FastSPICE simulation technology complements UMC’s 28HPC U+ processes by providing our mutual customers with a highly accurate, high-performance verification solution. We look forward to our continued partnership with UMC for a wide range of technology nodes.”
Siemens‘ Analog FastSPICE platform provides leading-edge circuit verification for nanometer analog, radio frequency (RF), mixed-signal, memory and custom digital circuits. It delivers a unified platform with mixed-signal and variation-aware verification capabilities that have superior accuracy, performance, capacity and functionality.
“Verification using Siemens‘ AFS platform on UMC’s production-ready 28HPC U+ process technology reduces the time for proof of analog, improves verification accuracy and accelerates the design process for our shared customers,” said David Chen, senior division director of Technology Development at UMC. “We look forward to continuing our collaboration with Siemens to provide more design and verification tools for a variety of high-growth markets and applications.”
UMC’s 28HPC U+ platform offers a good balance between cost considerations and chip performance, and is well-suited for a range of applications requiring high-speed and low-power consumption, including integrated circuits (ICs) for Wi-Fi, digital TV and flash controllers applications. Compared to the company’s 28nm technology, the high-performance, low-power 28HPCU+ platform can offer up to a 15 percent boost in performance.
Suggested Items
IDTechEx Report on Quantum Technology: Nano-scale Physics for Massive Market Impact
04/30/2024 | PRNewswireThe quantum technology market leverages nano-scale physics to create revolutionary new devices for computing, sensing, and communications. Across the industry, quantum technology offers a paradigm shift in performance compared with incumbent solutions.
TSMC Certifies Ansys Multiphysics Platforms, Enabling Next-Gen AI and HPC Chips
04/30/2024 | PRNewswireAnsys announced the certification of its power integrity platforms for TSMC's N2 technology full production release. Both Ansys RedHawk-SC and Ansys Totem are certified for power integrity signoff on the N2 process, delivering significant speed and power advantages for high performance computing, mobile chips, and 3D-IC designs.
Koh Young Extends Invitation to the 2024 IEEE Electronic Components and Technology Conference
04/30/2024 | Koh YoungKoh Young, the industry leader in True3D measurement-based inspection solutions, invites you to join us at the at the 2024 IEEE Electronic Components and Technology Conference from May 28-31, 2024, in Denver, Colorado at the Gaylord Rockies Resort & Convention Center.
Samsung Electronics Begins Industry’s First Mass Production of 9th-Gen V-NAND
04/29/2024 | Samsung ElectronicsSamsung Electronics, the world leader in advanced memory technology, today announced that it has begun mass production for its one-terabit (Tb) triple-level cell (TLC) 9th-generation vertical NAND (V-NAND), solidifying its leadership in the NAND flash market.
TSMC Celebrates 30th North America Technology Symposium
04/29/2024 | TSMCTSMC unveiled its newest semiconductor process, advanced packaging, and 3D IC technologies for powering the next generation of AI innovations with silicon leadership at the Company’s 2024 North America Technology Symposium.