TDK Ventures Invests in 5G RAN Innovator Verana Networks
April 27, 2022 | PRNewswireEstimated reading time: 2 minutes
TDK Corporation announced that subsidiary TDK Ventures Inc. has invested in 5G infrastructure innovator Verana Networks to accelerate bringing their 5G radio access network (RAN) technology to market. Verana's solutions represent significant reduction in cost, improved performance, and more effective installation. The true potential of its approach is gaining traction with customers and investors.
As the demand for 5G data skyrockets, service providers will have to put their high-capacity millimeter wave (mmWave) spectrum into play. However, current 5G RAN products are designed for traditional cellular spectrum. Building a 5G network in mmWave spectrum with derivatives of these products has proven to be cost prohibitive. Verana is building a new 5G technology platform, from the grounds-up, with purpose-built software-defined hardware that delivers superior economics for dense outdoor small cell deployments in mmWave spectrum.
After demonstrated growth and development following a $10 million-plus A-round funding in 2020, several industry giants have taken quick interest in Verana's technology and have partnered to accelerate commercialization to improve their own 5G networks.
"We believe that our vision to dramatically improve the economics of millimeter wave deployments, and our decades of experience building innovative radio-access network products for major mobile network operators, gives us an edge in the fast-growing multi-billion-dollar market for 5G network infrastructure," said co-founder and CEO of Verana, Dr. Vedat Eyuboglu. "We are excited to have the support and backing of a sophisticated and experienced set of investors."
Verana's 5G RAN technology innovations continue a long tradition of excellence by company founders Dr. Vedat Eyuboglu and Amit Jain. This all-star team of serial entrepreneurs enabled the first all-IP 3G-based stations, first dual-mode 2G/3G small cells, and the first scalable 4G small-cell systems. With similar RAN approaches, they are already revolutionizing 5G.
"Verana has an experienced team, with a clear vision to accelerate digital transformation through the incoming megatrend that is 5G mmWave technology. Their innovative approach is accepted by experts as a game-changing way to reduce cost, and they've already established solid traction with important partners," said TDK Ventures President, Nicolas Sauvage. "The TDK Ventures team is excited to partner and further enable Verana's development. Our shared vision of a more connected world is a perfect opportunity for us to spread valued TDK Goodness and support Verana's vision to improve communication, AR/VR, and even IoT technology."
Verana's partnership with TDK Ventures begins with this investment to mature and accelerate their RAN technologies for commercialization. In addition to financial backing, TDK Ventures offers their vast network connections, including industry partners and exposure to other TDK business units. Their platform team also provides support to include early product validation, pilots, customer/channel/ecosystem access, market knowledge, operating expertise (e.g., materials, manufacturing, fabless, supply chain) and go-to-market/branding mentorship.
Suggested Items
IDTechEx Report on Quantum Technology: Nano-scale Physics for Massive Market Impact
04/30/2024 | PRNewswireThe quantum technology market leverages nano-scale physics to create revolutionary new devices for computing, sensing, and communications. Across the industry, quantum technology offers a paradigm shift in performance compared with incumbent solutions.
TSMC Certifies Ansys Multiphysics Platforms, Enabling Next-Gen AI and HPC Chips
04/30/2024 | PRNewswireAnsys announced the certification of its power integrity platforms for TSMC's N2 technology full production release. Both Ansys RedHawk-SC and Ansys Totem are certified for power integrity signoff on the N2 process, delivering significant speed and power advantages for high performance computing, mobile chips, and 3D-IC designs.
Koh Young Extends Invitation to the 2024 IEEE Electronic Components and Technology Conference
04/30/2024 | Koh YoungKoh Young, the industry leader in True3D measurement-based inspection solutions, invites you to join us at the at the 2024 IEEE Electronic Components and Technology Conference from May 28-31, 2024, in Denver, Colorado at the Gaylord Rockies Resort & Convention Center.
Samsung Electronics Begins Industry’s First Mass Production of 9th-Gen V-NAND
04/29/2024 | Samsung ElectronicsSamsung Electronics, the world leader in advanced memory technology, today announced that it has begun mass production for its one-terabit (Tb) triple-level cell (TLC) 9th-generation vertical NAND (V-NAND), solidifying its leadership in the NAND flash market.
TSMC Celebrates 30th North America Technology Symposium
04/29/2024 | TSMCTSMC unveiled its newest semiconductor process, advanced packaging, and 3D IC technologies for powering the next generation of AI innovations with silicon leadership at the Company’s 2024 North America Technology Symposium.