Quantic Electronics Adds Eulex Components
June 7, 2022 | PRNewswireEstimated reading time: Less than a minute
Quantic Electronics, a portfolio company of Arcline Investment Management, announced the addition of the capacitor technology of Eulex Components, Inc., a leader in the design, development and manufacture of ceramic capacitor components, to its suite of product offerings.
Founded in 2019, Eulex is focused on producing the highest performing, highest quality ceramic capacitors for the most demanding high-frequency, microwave, millimeterwave and 5G applications.
"Eulex brings a wealth of design expertise to our growing portfolio at Quantic," said Ross Sealfon, President and Chief Operating Officer at Quantic Electronics. "Eulex has patented a breakthrough technology enabling ceramic capacitors to achieve higher capacitance while using fewer dielectrics, improving overall temperature and frequency performance. Eulex's unique technology further strengthens our capacitor portfolio in the high and ultra-high frequency ranges."
"Our products deliver design advantages through small-footprint, low-profile packaging, and a wide voltage range. Eulex's products are fully tested up to 50Ghz, and we have a roadmap planned to achieve performance from 6.5 to 100 GHz," said Alex Moalemi, President and co-founder of Eulex Components. "Partnering with Quantic will allow us to rapidly scale our revolutionary capacitor technology enabling Eulex to reach its full potential."
Suggested Items
Samsung Electronics Begins Industry’s First Mass Production of 9th-Gen V-NAND
04/29/2024 | Samsung ElectronicsSamsung Electronics, the world leader in advanced memory technology, today announced that it has begun mass production for its one-terabit (Tb) triple-level cell (TLC) 9th-generation vertical NAND (V-NAND), solidifying its leadership in the NAND flash market.
TSMC Celebrates 30th North America Technology Symposium
04/29/2024 | TSMCTSMC unveiled its newest semiconductor process, advanced packaging, and 3D IC technologies for powering the next generation of AI innovations with silicon leadership at the Company’s 2024 North America Technology Symposium.
QinetiQ Achieves UK’s First Jet-to-Jet Teaming Between Aircraft and Autonomous Drone
04/29/2024 | QinetiQQinetiQ has successfully trialled the UK’s first Crewed-Uncrewed-Teaming demonstration between a crewed aircraft and an autonomous jet drone.
Warm Windows and Streamlined Skin Patches – IDTechEx Explores Flexible and Printed Electronics
04/26/2024 | IDTechExFlexible and printed electronics can be integrated into cars and homes to create modern aesthetics that are beneficial and easy to use. From luminous car controls to food labels that communicate the quality of food, the uses of this technology are endless and can upgrade many areas of everyday life.
iNEMI Packaging Tech Topic Series: Role of EDA in Advanced Semiconductor Packaging
04/26/2024 | iNEMIAdvanced semiconductor packaging with heterogenous integration has made on-package integration of multiple chips a crucial part of finding alternatives to transistor scaling. Historically, EDA tools for front-end and back-end design have evolved separately; however, design complexity and the increased number of die-to-die or die-to-substrate interconnections has led to the need for EDA tools that can support integration of overall design planning, implementation, and system analysis in a single cockpit.