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September 19, 2023 | StratEdgeEstimated reading time: Less than a minute
StratEdge Corporation will present its thermally-efficient line of post-fired and molded ceramic semiconductor packages at several upcoming events including European Microwave Week (EuMW), September 19-21, IMAPS International, October 3-4, and IEEE BCICTS, October 16-17. StratEdge packages dissipate heat from compound semiconductor devices such as gallium nitride (GaN), gallium arsenide (GaAs), and silicon carbide (SiC) and operate from DC to 63+ GHz. The packages provide ultra-low loss performance over a wide range of frequencies, depending on the style and mounting configuration. Many open-tooled designs are available with 50 ohm impedance, which provide convenience and ease for packaging your high-performance semiconductors.
Casey Krawiec, VP of Global Sales at StratEdge, emphasized, "We manufacture our packages with precision, using post-fired ceramics with laser-cut features to control tight tolerances, thermally-enhanced metal bases that dissipate heat, and electrical transition designs that provide exceptionally low electrical losses. For further optimized performance, StratEdge Assembly Services can package your devices in our new cleanroom, equipped with the latest precision wire bonding and die attach systems."
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