I-Connect007 Editor’s Choice: Five Must-Reads for the Week
April 5, 2024 | Andy Shaughnessy, I-Connect007Estimated reading time: 3 minutes
Spring has definitely sprung; it was 81 degrees last week in Atlanta, and this week it’s been in the 40s. That’s typical spring weather in Atlanta. My newly cut lawn is looking great, thanks to my “yard guy” Clive.
And now our industry’s trade show season is in full swing. I’m all checked in and heading to Anaheim to cover IPC APEX EXPO next week. There’s a lot going on there this year, especially in PCB design. The number of design-related conference classes continues to grow with each show. That’s a good thing: New designers are entering the workforce, slowly but surely, and many companies are losing their subject matter experts to retirement.
IPC APEX EXPO will be held in Anaheim for the next couple of years. The last time I attended in Anaheim was about 20 years ago, and I never did make it to Disneyland. I’m shooting for some Mouse time this year.
I need to finish packing, so without further ado, here’s my must-reads for this week. I hope to see you in California.
Tim’s Takeaways: The Art of Technical Instruction
Published April 4
Speaking of PCB design, do you have what it takes to be a design instructor? You might. As columnist Tim Haas explains, there’s a need for design instructors, and if you’re constantly doing research and reading the latest white papers, you might be a great candidate for a design instructor. He also provides a few horror stories from his design teaching days. Check it out.
Creators of SMT UHDI Test Board Vehicle Discuss this Important Project
Published April 4
Chrys Shea led the development of the SMT test vehicle a few years ago. As features continued to shrink, the industry saw a need for a UHDI test vehicle, so Chrys and Altium’s David Haboud sprang into action. In this audio interview, they discuss what it took to update the test vehicle to UHDI and why technologists working in UHDI should check it out for themselves.
Global Sourcing Spotlight: Don’t Be Afraid of Global Sourcing
Published April 3
No matter how good things are going, some of us have this nagging suspicion in the back of our minds that there’s another snafu waiting around the corner, and another supply chain shutdown probably ranks Numero Uno in that category. But as columnist Bob Duke explains, despite two shooting wars and our stressful relationship with China, global sourcing is not only looking solid—it actually might help bring nations closer together and stave off potential conflicts. As he says, “Business is all about people.”
Checking In With ICAPE Group
Published April 3
ICAPE operates in countries around the globe, from China to South Africa to the U.S., so the company has a pretty broad view of the fab industry. In this interview, ICAPE’s Erik Pedersen explains how they approach sustainability, what sustainability actually entails, and why value engineering is so critical.
IPC APEX EXPO 2024: There’s an App for That
Published April 3
If you’re heading to IPC APEX EXPO, you’ve probably noticed that there are so many classes and “special events” taking place, often at the same time. Make it easy on yourself and scan this handy-dandy APEX QR code, and you’ll be able to see each day’s events at a glance while getting alerts for the events that are most important to you.
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iNEMI Packaging Tech Topic Series: Role of EDA in Advanced Semiconductor Packaging
04/26/2024 | iNEMIAdvanced semiconductor packaging with heterogenous integration has made on-package integration of multiple chips a crucial part of finding alternatives to transistor scaling. Historically, EDA tools for front-end and back-end design have evolved separately; however, design complexity and the increased number of die-to-die or die-to-substrate interconnections has led to the need for EDA tools that can support integration of overall design planning, implementation, and system analysis in a single cockpit.
Cadence, TSMC Collaborate on Wide-Ranging Innovations to Transform System and Semiconductor Design
04/25/2024 | Cadence Design SystemsCadence Design Systems, Inc. and TSMC have extended their longstanding collaboration by announcing a broad range of innovative technology advancements to accelerate design, including developments ranging from 3D-IC and advanced process nodes to design IP and photonics.
Ansys, TSMC Enable a Multiphysics Platform for Optics and Photonics, Addressing Needs of AI, HPC Silicon Systems
04/25/2024 | PRNewswireAnsys announced a collaboration with TSMC on multiphysics software for TSMC's Compact Universal Photonic Engines (COUPE). COUPE is a cutting-edge Silicon Photonics (SiPh) integration system and Co-Packaged Optics platform that mitigates coupling loss while significantly accelerating chip-to-chip and machine-to-machine communication.
Siemens’ Breakthrough Veloce CS Transforms Emulation and Prototyping with Three Novel Products
04/24/2024 | Siemens Digital Industries SoftwareSiemens Digital Industries Software launched the Veloce™ CS hardware-assisted verification and validation system. In a first for the EDA (Electronic Design Automation) industry, Veloce CS incorporates hardware emulation, enterprise prototyping and software prototyping and is built on two highly advanced integrated circuits (ICs) – Siemens’ new, purpose-built Crystal accelerator chip for emulation and the AMD Versal™ Premium VP1902 FPGA adaptive SoC (System-on-a-chip) for enterprise and software prototyping.
Listen Up! The Intricacies of PCB Drilling Detailed in New Podcast Episode
04/25/2024 | I-Connect007In episode 5 of the podcast series, On the Line With: Designing for Reality, Nolan Johnson and Matt Stevenson continue down the manufacturing process, this time focusing on the post-lamination drilling process for PCBs. Matt and Nolan delve into the intricacies of the PCB drilling process, highlighting the importance of hole quality, drill parameters, and design optimization to ensure smooth manufacturing. The conversation covers topics such as drill bit sizes, aspect ratios, vias, challenges in drilling, and ways to enhance efficiency in the drilling department.