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New Episode Now Available: Designing for Reality—CAM, Materials, and Imaging

03/14/2024 | I-Connect007
In Episode 3, host Nolan Johnson talks to ASC Sunstone VP/Manager Matt Stevenson about what happens after CAM preparations are complete. Stevenson addresses the role of materials and stackup considerations and also walks listeners through what happens in the Imaging process.

Heraeus Printed Electronics, SUSS MicroTec Join Forces to Revolutionize High-Volume Semiconductor Manufacturing with Inkjet Technology

03/05/2024 | Heraeus
Heraeus Printed Electronics GmbH and SUSS MicroTec have announced the signing of a Joint Development Agreement (JDA) to pave the way for digital inkjet printing of metallic coatings for semiconductor manufacturing.

Siemens Joins Semiconductor Education Alliance to Address Skills and Talent Shortage in Global Semiconductor Industry

03/04/2024 | Siemens
Siemens Digital Industries Software announced it has joined the Semiconductor Education Alliance to help build and nurture thriving communities of practice across the integrated circuit (IC) design and Electronic Design Automation (EDA) industries, from teachers and schools to universities, publishers, educational technology companies and research organizations.

FPT and Siemens Ink MOU, Accelerating Multifaceted Cooperation Globally

02/29/2024 | BUSINESS WIRE
Global IT corporation FPT recently signed a Memorandum of Understanding (MoU) with the multinational industrial technology conglomerate Siemens, fostering collaboration and mutually beneficial business opportunities in advancing the manufacturing sector and semiconductor chip production while accelerating digital transformation globally.

Wearable Devices Teams up with Qualcomm to Elevate Extended Reality Experience

02/28/2024 | Globe Newswire
Wearable Devices Ltd. , a technology growth company specializing in artificial intelligence (“AI")-powered touchless sensing wearables, today announced a collaboration agreement with Qualcomm Technologies, Inc. This collaboration will help those looking to use Wearable Devices' innovative Mudra technology when developing products using the Qualcomm Snapdragon Spaces™ XR Developer Platform, redefining interaction in augmented reality (“AR”) and virtual reality (“VR”) environments.
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