Siemens Joins Intel Foundry Services’ EDA Alliance Program
February 8, 2022 | SiemensEstimated reading time: 2 minutes
As a member of the Intel Foundry Services (IFS) Accelerator, EDA Alliance, Siemens plans to collaborate closely with IFS to optimize best-in-class IC design tools, flows and methodologies for Intel’s world-class processes.
Siemens Digital Industries Software today announced it has become a charter member of the Intel Foundry Services (IFS) Accelerator - EDA Alliance, a program committed to establishing an ecosystem for the design and fabrication of next generation System-on-Chip (SoCs) manufactured on IFS’ leading-edge process technologies.
The initiative promotes collaboration between IFS and its ecosystem partners, with a focus on reducing risk and tackling design barriers while accelerating time-to-market for mutual customers’ products. IFS Accelerator - EDA Alliance partners receive early access to Intel process and packaging technologies, allowing them to co-optimize and enhance tools and flows to best realize Intel’s technology capabilities.
“We are excited to announce the IFS Ecosystem Alliance as a major step forward for Intel's foundry ambitions,” said Rahul Goyal, vice president and general manager for Intel Product & Design Ecosystem Enablement. “We are pleased that Siemens EDA has joined the program. The combination of Siemens’ world-class EDA offerings and IFS' leading-edge process technologies will provide design teams across the industry with the solutions needed to deliver in today's competitive IC markets.”
As part of the alliance, Siemens plans to collaborate closely with IFS to optimize best-in-class IC design tools, flows and methodologies for Intel’s world-class processes. The initial Siemens EDA product lines certified by IFS include the industry-leading Calibre® nm platform, as well as the Analog FastSPICE (AFS) platform for leading-edge circuit verification targeting nanometer analog, radio frequency (RF), mixed-signal, memory and custom digital circuits.
“With the increasing importance of semiconductors in the global economy, Intel’s commitment to the foundry market through IFS is an important new source of innovative capacity for advanced products,” said Joe Sawicki, executive vice president, IC-EDA for Siemens Digital Industries Software. “Siemens is proud to collaborate with IFS to help provide software solutions that are tuned to allow mutual customers to get the most out of Intel process and packaging technologies.”
- The Printed Circuit Designer’s Guide to... Stackups: The Design within the Design by Bill Hargin (a free eBook available for download)
- The Printed Circuit Assembler's Guide to ...Smart Data: Using Data to Improve Manufacturing?by Sagi Reuven and Zac Elliott (a free eBook available for download)?
- The Printed Circuit Assembler's Guide to… Advanced Manufacturing in the Digital Age? by Oren Manor (a free eBook available for download)?
- The Printed Circuit Designer’s Guide to… PowerIntegrity by Example by Fadi Deek (a free eBook available for download)
- Siemens’ free, 12-part, on-demand webinar series?“Implementing Digital Twin Best Practices?From?Design Through Manufacturing.”?
- RealTime?With ...?Siemens and Computrol: Achieving Operational Excellence in Electronics Manufacturing?
- You can also view other titles in our full I-007eBook library here
Suggested Items
iNEMI Packaging Tech Topic Series: Role of EDA in Advanced Semiconductor Packaging
04/26/2024 | iNEMIAdvanced semiconductor packaging with heterogenous integration has made on-package integration of multiple chips a crucial part of finding alternatives to transistor scaling. Historically, EDA tools for front-end and back-end design have evolved separately; however, design complexity and the increased number of die-to-die or die-to-substrate interconnections has led to the need for EDA tools that can support integration of overall design planning, implementation, and system analysis in a single cockpit.
Cadence, TSMC Collaborate on Wide-Ranging Innovations to Transform System and Semiconductor Design
04/25/2024 | Cadence Design SystemsCadence Design Systems, Inc. and TSMC have extended their longstanding collaboration by announcing a broad range of innovative technology advancements to accelerate design, including developments ranging from 3D-IC and advanced process nodes to design IP and photonics.
Ansys, TSMC Enable a Multiphysics Platform for Optics and Photonics, Addressing Needs of AI, HPC Silicon Systems
04/25/2024 | PRNewswireAnsys announced a collaboration with TSMC on multiphysics software for TSMC's Compact Universal Photonic Engines (COUPE). COUPE is a cutting-edge Silicon Photonics (SiPh) integration system and Co-Packaged Optics platform that mitigates coupling loss while significantly accelerating chip-to-chip and machine-to-machine communication.
Siemens’ Breakthrough Veloce CS Transforms Emulation and Prototyping with Three Novel Products
04/24/2024 | Siemens Digital Industries SoftwareSiemens Digital Industries Software launched the Veloce™ CS hardware-assisted verification and validation system. In a first for the EDA (Electronic Design Automation) industry, Veloce CS incorporates hardware emulation, enterprise prototyping and software prototyping and is built on two highly advanced integrated circuits (ICs) – Siemens’ new, purpose-built Crystal accelerator chip for emulation and the AMD Versal™ Premium VP1902 FPGA adaptive SoC (System-on-a-chip) for enterprise and software prototyping.
Listen Up! The Intricacies of PCB Drilling Detailed in New Podcast Episode
04/25/2024 | I-Connect007In episode 5 of the podcast series, On the Line With: Designing for Reality, Nolan Johnson and Matt Stevenson continue down the manufacturing process, this time focusing on the post-lamination drilling process for PCBs. Matt and Nolan delve into the intricacies of the PCB drilling process, highlighting the importance of hole quality, drill parameters, and design optimization to ensure smooth manufacturing. The conversation covers topics such as drill bit sizes, aspect ratios, vias, challenges in drilling, and ways to enhance efficiency in the drilling department.